Patents by Inventor Yuusuke TAKEI

Yuusuke TAKEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor wiring substrate, sensor package, and sensor device
    Patent number: 11105738
    Abstract: The present invention relates to a sensor wiring substrate in which a decrease in detection accuracy is suppressed, a sensor package, and a sensor device. A gas sensor wiring substrate includes a substrate having a first accommodation recessed portion for accommodating a microphone element and a second accommodation recessed portion for accommodating an infrared light emitting element, and connection wiring. In the gas sensor wiring substrate, thermal resistance of a heat transfer path between a bottom surface of the first accommodation recessed portion and a bottom surface of the second accommodation recessed portion is greater than thermal resistance in any position of an imaginal heat transfer path in case of a depth of the first accommodation recessed portion identical with a depth of the second accommodation recessed portion. For example, the depth of the second accommodation recessed portion is deeper than the depth of the first accommodation recessed portion.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: August 31, 2021
    Assignee: KYOCERA CORPORATION
    Inventors: Yuusuke Takei, Ryuuji Mori
  • Optical element mounting package, electronic device, and electronic module
    Patent number: 10554012
    Abstract: An optical element mounting package includes a substrate including a recess comprising a bottom surface on which an optical element is to be mounted, and a side wall comprising an opening. The bottom surface of the recess has a cutout adjacent to the opening.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: February 4, 2020
    Assignee: KYOCERA CORPORATION
    Inventors: Mitsuharu Sakai, Yuusuke Takei
  • SENSOR WIRING SUBSTRATE, SENSOR PACKAGE, AND SENSOR DEVICE
    Publication number: 20190376889
    Abstract: The present invention relates to a sensor wiring substrate in which a decrease in detection accuracy is suppressed, a sensor package, and a sensor device. A gas sensor wiring substrate includes a substrate having a first accommodation recessed portion for accommodating a microphone element and a second accommodation recessed portion for accommodating an infrared light emitting element, and connection wiring. In the gas sensor wiring substrate, thermal resistance of a heat transfer path between a bottom surface of the first accommodation recessed portion and a bottom surface of the second accommodation recessed portion is greater than thermal resistance in any position of an imaginal heat transfer path in case of a depth of the first accommodation recessed portion identical with a depth of the second accommodation recessed portion. For example, the depth of the second accommodation recessed portion is deeper than the depth of the first accommodation recessed portion.
    Type: Application
    Filed: November 17, 2017
    Publication date: December 12, 2019
    Applicant: KYOCERA Corporation
    Inventors: Yuusuke TAKEI, Ryuuji MORI
  • OPTICAL ELEMENT MOUNTING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    Publication number: 20180145478
    Abstract: An optical element mounting package includes a substrate including a recess comprising a bottom surface on which an optical element is to be mounted, and a side wall comprising an opening. The bottom surface of the recess has a cutout adjacent to the opening.
    Type: Application
    Filed: April 18, 2016
    Publication date: May 24, 2018
    Applicant: KYOCERA Corporation
    Inventors: Mitsuharu SAKAI, Yuusuke TAKEI