Patents by Inventor Yuuta Terao

Yuuta Terao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240092981
    Abstract: A problem of heat dissipation in motors, converters, high-luminance LEDs, power devices, power supplies, and the like becomes significant. Provided is a means for capable of providing a product, which has favorable workability, segregation stability, storage stability, and the like, penetrates into a gap in a coil portion, an interface in casing, and the like without any gaps, enhances thermal conductivity/heat dissipation properties of a molded product thus obtained, and is excellent in electrical characteristics, toughness/elastic modulus, thermal resistance, thermal cycle properties, and the like, in the case of using the product for a cast molding resin, a pottingmaterial (sealingmaterial), an adhesive, grease, and the like.
    Type: Application
    Filed: October 20, 2023
    Publication date: March 21, 2024
    Applicant: Takagi Chemicals, Inc.
    Inventors: Noriaki Takagi, Masakuni Takagi, Yuusuke Nagatani, Yuuta Terao, Daisuke Watanabe, Kazuo Matsuyama
  • Patent number: 10851277
    Abstract: [Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: December 1, 2020
    Assignee: TAKAGI CHEMICALS, INC.
    Inventors: Noriaki Takagi, Yuusuke Nagatani, Yuuta Terao, Kazuo Matsuyama, Tsutomu Takeichi, Akihiko Matsumoto
  • Publication number: 20200062911
    Abstract: A filler-loaded thermal conductive liquid compositions formed by dispersing a powder composition, which contains polymer particles containing thermoplastic polymer particles, and thermal conductive filler particles containing particles having a graphite-like structure, obtained by pulverizing 5-70 parts by weight of the polymer particles and 30-95 parts by weight of the thermal conductive filler particles, the filler particles being covered with micronized polymer particles and the covered particles being uniformly dispersed, using 25-250 parts by weight of a liquid reactive dispersing medium and/or a dispersing medium containing a thermoplastic polymer having a deflection temperature under load or a melting point lower than the thermoplastic polymer used in the powder composition, and the liquid composition having conditions that a thermal conductive infinite cluster exhibiting a thermal conductivity of 1-35 w/mk is formed and a concentration of thermal conductive filler particles is equal to or more than a
    Type: Application
    Filed: September 27, 2018
    Publication date: February 27, 2020
    Applicant: Takagi Chemicals, Inc.
    Inventors: Noriaki Takagi, Masakuni Takagi, Yuusuke Nagatani, Yuuta Terao, Daisuke Watanabe, Kazuo Matsuyama
  • Publication number: 20190309204
    Abstract: [Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.
    Type: Application
    Filed: January 10, 2019
    Publication date: October 10, 2019
    Applicant: Takagi Chemicals, Inc.
    Inventors: Noriaki Takagi, Yuusuke Nagatani, Yuuta Terao, Kazuo Matsuyama, Tsutomu Takeichi, Akihiko Matsumoto
  • Publication number: 20150259589
    Abstract: [Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.
    Type: Application
    Filed: November 1, 2013
    Publication date: September 17, 2015
    Applicant: Takagi Chemicals, Inc.
    Inventors: Noriaki Takagi, Yuusuke Nagatani, Yuuta Terao, Kazuo Matsuyama, Tsutomu Takeichi, Akihiko Matsumoto