Publication number: 20240092981
Abstract: A problem of heat dissipation in motors, converters, high-luminance LEDs, power devices, power supplies, and the like becomes significant. Provided is a means for capable of providing a product, which has favorable workability, segregation stability, storage stability, and the like, penetrates into a gap in a coil portion, an interface in casing, and the like without any gaps, enhances thermal conductivity/heat dissipation properties of a molded product thus obtained, and is excellent in electrical characteristics, toughness/elastic modulus, thermal resistance, thermal cycle properties, and the like, in the case of using the product for a cast molding resin, a pottingmaterial (sealingmaterial), an adhesive, grease, and the like.
Type:
Application
Filed:
October 20, 2023
Publication date:
March 21, 2024
Applicant:
Takagi Chemicals, Inc.
Inventors:
Noriaki Takagi, Masakuni Takagi, Yuusuke Nagatani, Yuuta Terao, Daisuke Watanabe, Kazuo Matsuyama