Abstract: An electronic component that includes: a base body; wiring inside the base body; a glass film covering an outer surface of the base body; an underlying electrode electrically connected to the wiring and covering a part of the glass film; and a metal layer covering the underlying electrode, wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 ?m, and a boundary portion that is not covered with the underlying electrode and not separated from the outer edge of the underlying electrode by more than 10 ?m, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.

Abstract: An electronic component that includes: a base body having an outer surface defining a recess with an inner surface, wherein, when the recess is viewed in a direction orthogonal to the outer surface, at least a part of an outer edge of the recess is curved, and when the recess is viewed in a section orthogonal to the outer surface, at least a part of the inner surface of the recess is curved; a wiring inside the base body; and a glass film covering the outer surface of the base body and not covering the inner surface of the recess.

Abstract: A mixing container for mixing multiple materials comprises a container body in which multiple storage chambers are formed in a storage part by a partition wall that is a raised portion of a wall surface forming the storage part, and a lid member attached to the container body such that the multiple storage chambers are separately sealed; the partition wall is configured to be deformable into a concave part recessed in a movement direction of the partition wall through movement in a direction from the lid member toward the container body with a circumferential edge of the storage part sealed to the lid member; and when the partition wall is deformed into the concave part, the multiple storage chambers are deformed into one storage chamber.

Abstract: A mixing container for mixing multiple materials comprises a container body in which multiple storage chambers are formed in a storage part by a partition wall that is a raised portion of a wall surface forming the storage part, and a lid member attached to the container body such that the multiple storage chambers are separately sealed; the partition wall is configured to be deformable into a concave part recessed in a movement direction of the partition wall through movement in a direction from the lid member toward the container body with a circumferential edge of the storage part sealed to the lid member; and when the partition wall is deformed into the concave part, the multiple storage chambers are deformed into one storage chamber.

Abstract: According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

Abstract: According to one embodiment, a semiconductor memory device includes: a substrate including a memory capable of storing data and a controller controlling the memory, and a housing including first and second housing parts and holding the substrate therein. The first housing part includes a fixing unit which has elasticity and is in contact with the substrate.

Abstract: According to one embodiment, a USB memory device includes: a substrate including a semiconductor chip, a plurality of operating terminals, a reference potential terminal and a reference potential wiring; and a housing holding the substrate inside, being electrically connected to the reference potential terminal, and having electric conductivity. The reference potential wiring electrically connects the operating terminal with the reference potential terminal.

Abstract: According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

Abstract: According to one embodiment, a semiconductor device includes a case, a connector, and a cap. The case includes a first main surface, a second main surface opposite to the first main surface, a first concave portion provided with at least one of the first main surface and the second main surface, and a semiconductor memory housed inside. The connector is connected to the case. The cap includes a third main surface, a fourth main surface opposite to the third main surface, a locking portion provided with at least one of the third main surface and the fourth main surface which is locked with the first concave portion, and a side surface provided with an opening portion opening between the third main surface and the fourth main surface.