Patents by Inventor Yuuto AOKI

Yuuto AOKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio frequency module and communication device
    Patent number: 11411586
    Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: August 9, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidetaka Takahashi, Satoshi Goto, Yoshiki Yasutomo, Daerok Oh, Yuuto Aoki, Yoshihiro Daimon, Naoya Matsumoto
  • RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
    Publication number: 20210288680
    Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.
    Type: Application
    Filed: March 2, 2021
    Publication date: September 16, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hidetaka TAKAHASHI, Satoshi GOTO, Yoshiki YASUTOMO, Daerok OH, Yuuto AOKI, Yoshihiro DAIMON, Naoya MATSUMOTO