Patents by Inventor Yuuya Kitade

Yuuya Kitade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11898070
    Abstract: Provided are an adhesive tape having high flex resistance that can withstand repeated bending by folding operations and the like while maintaining high impact resistance, and an electronic device including the adhesive tape. The adhesive tape has an adhesive layer on one side or both sides of a foam base directly or with another layer interposed, in which the foam base contains an elastomer resin as a main component. The foam base has a tensile stress of 150 N/cm2 or less at 100% strain based on a stress-strain curve and a foam density of 0.2 g/cm3 to 2.0 g/cm3.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: February 13, 2024
    Assignee: DIC Corporation
    Inventors: Yoshimi Furukawa, Yuuya Kitade, Yuusuke Takahashi, Takeshi Iwasaki
  • Patent number: 11827822
    Abstract: Provided is an adhesive tape that has satisfactory conformability to a high step of an adherend while maintaining high impact resistance, and has removable performance that enables easy peeling when articles, such as electronic devices, are disassembled. The adhesive tape has an adhesive layer on one side or both sides of a foam base directly or with another layer interposed therebetween. The foam base has a tensile strength of 650 N/cm2 or more in a flow direction, a compressive strength at 25% of 1000 kPa or less, and a density of 0.35 g/cm3 to 0.90 g/cm3.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: November 28, 2023
    Assignee: DIC Corporation
    Inventors: Yoshimi Furukawa, Yuuya Kitade, Yuusuke Takahashi, Takeshi Iwasaki
  • Publication number: 20230022110
    Abstract: Provided is an adhesive tape that has satisfactory conformability to a high step of an adherend while maintaining high impact resistance, and has removable performance that enables easy peeling when articles, such as electronic devices, are disassembled. The adhesive tape has an adhesive layer on one side or both sides of a foam base directly or with another layer interposed therebetween. The foam base has a tensile strength of 650 N/cm2 or more in a flow direction, a compressive strength at 25% of 1000 kPa or less, and a density of 0.35 g/cm3 to 0.90 g/cm3.
    Type: Application
    Filed: June 24, 2022
    Publication date: January 26, 2023
    Applicant: DIC Corporation
    Inventors: Yoshimi Furukawa, Yuuya Kitade, Yuusuke Takahashi, Takeshi Iwasaki
  • Publication number: 20230026124
    Abstract: Provided are an adhesive tape having high flex resistance that can withstand repeated bending by folding operations and the like while maintaining high impact resistance, and an electronic device including the adhesive tape. The adhesive tape has an adhesive layer on one side or both sides of a foam base directly or with another layer interposed, in which the foam base contains an elastomer resin as a main component. The foam base has a tensile stress of 150 N/cm2 or less at 100% strain based on a stress-strain curve and a foam density of 0.2 g/cm3 to 2.0 g/cm3.
    Type: Application
    Filed: June 24, 2022
    Publication date: January 26, 2023
    Applicant: DIC Corporation
    Inventors: Yoshimi Furukawa, Yuuya Kitade, Yuusuke Takahashi, Takeshi Iwasaki