Abstract: An optical resin sheet includes a cured resin layer containing glass fiber, wherein the ratio of the elastic modulus of the glass fiber to the elastic modulus of a cured resin material, which forms the cured resin layer, is 25 or more. With the thus arranged optical resin sheet, stress is applied to the glass fiber, thereby reducing the phenomenon of occurrence of birefringence, and when it is applied to a display device, there is achieved a significantly small light leakage in an oblique direction. The optical resin sheet is capable of achieving excellent display quality of an image display device such as a liquid crystal display device, as well as keeping the coefficient of thermal expansion lower and the mechanical strength higher.

Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.

Abstract: An optical resin sheet includes a cured resin layer containing glass fiber, wherein the ratio of the elastic modulus of the glass fiber to the elastic modulus of a cured resin material, which forms the cured resin layer, is 25 or more. With the thus arranged optical resin sheet, stress is applied to the glass fiber, thereby reducing the phenomenon of occurrence of birefringence, and when it is applied to a display device, there is achieved a significantly small light leakage in an oblique direction. The optical resin sheet is capable of achieving excellent display quality of an image display device such as a liquid crystal display device, as well as keeping the coefficient of thermal expansion lower and the mechanical strength higher.

Abstract: A resin sheet that is unlikely to be affected by heat and allows prevention of the occurrence of a crack is provided. A glass fiber cloth-like material is dipped into an epoxy resin solution and subjected to curing, thereby obtaining an epoxy resin-based sheet including the glass fiber cloth-like material. The resin sheet has a haze value of 10% or lower, and preferably, has a light transmittance of 88% or higher, an in-plane retardation of not more than 2 nm, a retardation in a thickness direction of 40 nm, and a surface roughness of not more than 2 ?m.

Abstract: There is provided a resin sheet that achieves improvement in lightweight, low-profile and high impact characteristics, suppresses thermal shrinkage and expansion and is excellent in light transparency so as to prevent the display quality or the like of a display device from being deteriorated, as well as a substrate for a display device, a display device and a substrate for a solar cell, each having the aforesaid resin sheet. A resin sheet includes a cured resin layer containing in a resin a glass fiber cloth-like material and inorganic particles, and is structured to have a haze value of 10% or lower.

Abstract: In the present invention, there is provided a laminated film that is excellent in terms of mechanical strength and low coefficient of thermal expansion. According to the present invention, there is provided a laminated film, which is characterized in that it comprises a resin sheet having a cured resin layer containing glass cloth and a polarizing plate laminated on the resin sheet, in which any one of weft yarn and warp yarn of the glass cloth is oriented at an angle of 5 degrees or less relative to an absorption axis of the polarizing plate.

Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.

Abstract: There is provided a resin sheet that achieves improvement in lightweight, low-profile and high impact characteristics, suppresses thermal shrinkage and expansion and is excellent in light transparency so as to prevent the display quality or the like of a display device from being deteriorated, as well as a substrate for a display device, a display device and a substrate for a solar cell, each having the aforesaid resin sheet. A resin sheet includes a cured resin layer containing a glass fiber cloth-like material and an overcoat layer laminated on the cured resin layer to have a surface roughness Rt of 200 nm or less, and is structured to have a haze value of 10% or lower.

Abstract: The present invention provides a method of manufacturing a laminated polarizing plate that can prevent projections and swellings from being produced at cutting planes in manufacturing the laminated polarizing plate that is excellent in self-standing ability. A polarizing plate and a resin film are laminated together and then this laminate is cut with a dicer. Thus a laminated polarizing plate is manufactured. A film having a light transmittance of at least 80% and a glass-transition temperature of at least 100° C. is used for the resin film. For instance, an epoxy resin film is preferable as the resin film.

Abstract: A resin sheet that is unlikely to be affected by heat and allows prevention of the occurrence of a crack is provided. A glass fiber cloth-like material is dipped into an epoxy resin solution and subjected to curing, thereby obtaining an epoxy resin-based sheet including the glass fiber cloth-like material. The resin sheet has a haze value of 10% or lower, and preferably, has a light transmittance of 88% or higher, an in-plane retardation of not more than 2 nm, a retardation in a thickness direction of 40 nm, and a surface roughness of not more than 2 ?m.

Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.