Patents by Inventor Yuuzou Shimada

Yuuzou Shimada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stack module
    Patent number: 5883426
    Abstract: A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto which are mounted semiconductor chips are used to stack the substrates to four levels, three wave-shaped heat-radiating elements, made of copper, being in thermal contact between the semiconductor chips of three of the mounting substrates and the rear surfaces of three of the mounting substrates, making use of the spring elasticity of the heat-radiating elements to establish this thermal contact.
    Type: Grant
    Filed: April 18, 1997
    Date of Patent: March 16, 1999
    Assignee: NEC Corporation
    Inventors: Kenichi Tokuno, Ikushi Morisaki, Akihiro Doya, Manabu Bonkohara, Naoji Senba, Yuuzou Shimada, Kazuaki Utumi