Patents by Inventor Yuval Alpert

Yuval Alpert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240114548
    Abstract: A device configured to communicate via a Wi-Fi channel obtains a contention-free access period on the Wi-Fi channel. The device sends a first probe packet to a receiving Wi-Fi device during the contention-free access period, with at least one parameter of a Wi-Fi transmitter of the Wi-Fi transceiver set to a first setting, and waits for a first reply period. The device sends a second probe packet to the receiving Wi-Fi device during the contention-free access period, with the at least one parameter of the Wi-Fi transmitter set to a second setting, where the second setting is based on a result of the first reply period, and waits for a second reply period. The device sets the at least one parameter of the Wi-Fi transmitter to a data packet setting, where the data packet setting is based at least on a result of the second reply period.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 4, 2024
    Inventors: Yuval MATAR, Yaron ALPERT
  • Publication number: 20240073976
    Abstract: In at least one example, a method includes transmitting, by a first device, probe packets to a second device on multiple links over N transmission opportunities (TXOPs) with synchronous probing transmissions on the multiple links during each TXOP. N is an integer value greater than 1. Each probe packet corresponds to a different set of transmission parameters. Each link is established between the first device and the second device over different channels of a wireless transmission medium. The method further includes receiving, by the first device responsive to transmitting the probe packets, feedback from the second device on the multiple links in tandem with the synchronous probing transmissions over the N TXOPs. The method further includes selecting, by the first device, a preferred link from among the multiple links based on the feedback.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: Yaron ALPERT, Yuval MATAR
  • Patent number: 7666035
    Abstract: A double-sided USB connector may include a first PCB that may provide a first set of electrical contacts on its first side and solder pads on its second side. The first PCB may further include a components side, solder pads, and signal traces. The double-sided USB connector may also include a second PCB that may provide a second set of electrical contacts on its first side and terminals on its second side. Contacts selected from the second set of contacts may be connected to selected terminals, for example through via paths in the second PCB. Contacts from the first and second sets of contacts may selectively be connected to components on the first PCB using signal traces rather than wires. The first PCB may be joined to the second PCB by using the terminals, and the two PCBs may be packaged using a common molded body.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: February 23, 2010
    Assignee: Sandisk IL Ltd.
    Inventors: Tavi Salomon, Yuval Alpert, Shahar Ben-David
  • Publication number: 20080299834
    Abstract: A double-sided USB connector may include a first PCB that may provide a first set of electrical contacts on its first side and solder pads on its second side. The first PCB may further include a components side, solder pads, and signal traces. The double-sided USB connector may also include a second PCB that may provide a second set of electrical contacts on its first side and terminals on its second side. Contacts selected from the second set of contacts may be connected to selected terminals, for example through via paths in the second PCB. Contacts from the first and second sets of contacts may selectively be connected to components on the first PCB using signal traces rather than wires. The first PCB may be joined to the second PCB by using the terminals, and the two PCBs may be packaged using a common molded body.
    Type: Application
    Filed: August 14, 2008
    Publication date: December 4, 2008
    Applicant: Sandisk IL Ltd.
    Inventors: Tavi Salomon, Yuval Alpert, Shahar Ben-David
  • Patent number: 7442091
    Abstract: A double-sided USB connector may include a first PCB that may provide a first set of electrical contacts on its first side and solder pads on its second side. The first PCB may further include a components side, solder pads, and signal traces. The double-sided USB connector may also include a second PCB that may provide a second set of electrical contacts on its first side and terminals on its second side. Contacts selected from the second set of contacts may be connected to selected terminals, for example through via paths in the second PCB. Contacts from the first and second sets of contacts may selectively be connected to components on the first PCB using signal traces rather than wires. The first PCB may be joined to the second PCB by using the terminals, and the two PCBs may be packaged using a common molded body.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: October 28, 2008
    Assignee: SanDisk iL Ltd.
    Inventors: Tavi Salomon, Yuval Alpert, Shahar Ben David
  • Publication number: 20080139006
    Abstract: A double-sided USB connector may include a first PCB that may provide a first set of electrical contacts on its first side and solder pads on its second side. The first PCB may further include a components side, solder pads, and signal traces. The double-sided USB connector may also include a second PCB that may provide a second set of electrical contacts on its first side and terminals on its second side. Contacts selected from the second set of contacts may be connected to selected terminals, for example through via paths in the second PCB. Contacts from the first and second sets of contacts may selectively be connected to components on the first PCB using signal traces rather than wires. The first PCB may be joined to the second PCB by using the terminals, and the two PCBs may be packaged using a common molded body.
    Type: Application
    Filed: December 6, 2007
    Publication date: June 12, 2008
    Applicant: SANDISK IL LTD.
    Inventors: Tavi Salomon, Yuval Alpert, Shahar Ben-David
  • Patent number: D645375
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: September 20, 2011
    Assignee: Ruby Kobo Inc.
    Inventors: Yuval Alpert, Danna Kobo
  • Patent number: D645773
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: September 27, 2011
    Assignee: Ruby Kobo Inc.
    Inventors: Yuval Alpert, Danna Kobo
  • Patent number: D684494
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: June 18, 2013
    Assignee: Shashi, Inc.
    Inventors: Yuval Alpert, Danna Kobo
  • Patent number: D684495
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: June 18, 2013
    Assignee: Shashi, Inc.
    Inventors: Yuval Alpert, Danna Kobo