Patents by Inventor Yuval Dorphan

Yuval Dorphan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7804993
    Abstract: A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: September 28, 2010
    Assignee: Applied Materials South East Asia Pte. Ltd.
    Inventors: Yuval Dorphan, Ran Zaslavsky, Mark Wagner, Dov Furman, Shai Silberstein
  • Publication number: 20060193506
    Abstract: A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.
    Type: Application
    Filed: February 28, 2005
    Publication date: August 31, 2006
    Applicant: Negevtech Ltd.
    Inventors: Yuval Dorphan, Ran Zaslavsky, Mark Wagner, Dov Furman, Shai Silberstein