Patents by Inventor Yu-wei Wang

Yu-wei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260319956
    Abstract: Write-back operations are grouped into a write-back group to enhance data locality. A control circuitry of a cache receives a memory access request that causes new data to be written into the cache. The cache is organized into multiple sets, and the memory access request indicates an address that belongs to a target set of the cache. The control circuitry identifies a target cache line in the target set as an evict victim. The control circuitry searches in neighboring sets of the target set to identify one or more dirty cache lines having neighboring addresses of the evict victim. The control circuitry groups write-back operations of the evict victim and the one or more dirty cache lines into one write-back group to write back to a memory.
    Type: Application
    Filed: April 14, 2025
    Publication date: October 15, 2026
    Inventors: Yu-Wei Wang, Po-Han Wang, Kee Khuan Yu, Sheng-Wei Liao
  • Publication number: 20260296557
    Abstract: Vehicle reinforcement systems are provided including systems that comprise a plurality of support members configured to absorb energy from an impact on a side of the vehicle. Preferred support members have a tubular configuration and may be composed of distinct steel compositions that differ in one or more properties.
    Type: Application
    Filed: March 26, 2025
    Publication date: October 1, 2026
    Inventors: Alex L. Khutorsky, Harsha Kusnoorkar, Yu-Wei Wang, Miao Yu
  • Patent number: 12696555
    Abstract: A photodiode comprises a substrate, a first collection layer, a first type well layer, a second type well layer and a second collection layer. The substrate has a first surface and a second surface. The substrate defines a bias region and a signal region. The first collection layer, the first type well layer, the first type well layer, the second type well layer, and the second collection layer are formed in the substrate. The first type well layer is disposed between the first surface and the first collection layer. The second type well layer is disposed between the first type well layer and the first collection layer. The second collection layer is located between the first surface and the second well layer.
    Type: Grant
    Filed: March 31, 2023
    Date of Patent: July 28, 2026
    Assignee: PixArt Imaging Inc.
    Inventors: Ren-Yu He, Yu-Wei Wang
  • Publication number: 20260186971
    Abstract: A method for processing memory commands in a computing system comprises: transmitting, from a coherence hub to a downstream cache subsystem, a plurality of sub-commands, each of the sub-commands corresponding to a cache line size; receiving, at the downstream cache subsystem, at least one of the plurality of sub-commands; in response to receiving the at least one sub-command, determining, by the downstream cache subsystem, a full address range of the data block; and performing, by the downstream cache subsystem, an optimized memory operation directed to a downstream memory subsystem.
    Type: Application
    Filed: December 23, 2025
    Publication date: July 2, 2026
    Applicant: MEDIATEK INC.
    Inventors: Yu-Wei Wang, Po-Han Wang, Teng-Feng Liao, Ke-Jen Lin
  • Publication number: 20260186976
    Abstract: A method for managing a cache memory is provided. The method includes associating a dataset with a cache maintenance operation (CMO) mode, wherein the CMO mode is a deferred mode. The method further includes storing a deferred CMO hint in a metadata portion of a cache line within the cache memory; storing a dataset identifier in the metadata portion of the cache line to associate the cache line with the dataset; receiving a trigger command associated with the dataset identifier; and performing the deferred CMO on one or more cache lines in the cache memory associated with the dataset identifier based on the trigger command.
    Type: Application
    Filed: September 16, 2025
    Publication date: July 2, 2026
    Applicant: MEDIATEK INC.
    Inventors: Yu-Wei Wang, Po-Han Wang, Ming-Hung Hsieh, Sheng-Wei Liao, Yu-Xin Lin, Sheng-Kai Lin, Ke-Jen Lin
  • Patent number: 12613319
    Abstract: A photodiode, comprising: a first photodiode, comprising a p type substrate and a signal output region; a positive electric field providing structure, provided in the P type substrate, configured to receive a positive voltage to provide a positive electric field according to the positive voltage to attract electrons in the P type substrate; wherein an avalanche region is formed when the positive voltage is larger than a threshold voltage, thereby a current path is formed between the signal output region and the positive electric field providing structure. The present invention also discloses an optical sensor comprising pixels with different light sensitivities.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: April 28, 2026
    Assignee: PixArt Imaging Inc.
    Inventor: Yu-Wei Wang
  • Patent number: 12599950
    Abstract: A system for forming a steel material includes a first binder, a second binder, a punch and a carrier blank. The first binder and the second binder are configured to form a draw bead shape in the steel material by compressing the steel material between a draw bead protrusion and a draw bead channel. The punch is configured to form the steel material relative to the first binder and the second binder. The carrier blank is positioned on a surface of the steel material and is configured to cover a portion of the draw bead shape during formation of the draw bead shape in the steel material.
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: April 14, 2026
    Assignee: Cleveland-Cliffs Steel Properties Inc.
    Inventors: Feng Zhu, Sobhan Nazari Tiji, Panagiotis Makrygiannis, Jimmy J. Zhang, Yu-Wei Wang
  • Patent number: D1110474
    Type: Grant
    Filed: July 10, 2024
    Date of Patent: January 27, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1112614
    Type: Grant
    Filed: July 5, 2024
    Date of Patent: February 10, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1112628
    Type: Grant
    Filed: July 10, 2024
    Date of Patent: February 10, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1114186
    Type: Grant
    Filed: July 23, 2024
    Date of Patent: February 17, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1116028
    Type: Grant
    Filed: July 5, 2024
    Date of Patent: March 3, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1116030
    Type: Grant
    Filed: November 8, 2024
    Date of Patent: March 3, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Chun-Yi Tu, Yu-Wei Wang
  • Patent number: D1117650
    Type: Grant
    Filed: September 3, 2024
    Date of Patent: March 10, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1120227
    Type: Grant
    Filed: August 16, 2024
    Date of Patent: March 24, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1121783
    Type: Grant
    Filed: July 23, 2024
    Date of Patent: April 7, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1128008
    Type: Grant
    Filed: August 19, 2024
    Date of Patent: May 26, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1131739
    Type: Grant
    Filed: September 3, 2024
    Date of Patent: June 23, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Yi-Shan Chiang, Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Yu-Wei Wang, Chih-An Lin
  • Patent number: D1138996
    Type: Grant
    Filed: October 18, 2024
    Date of Patent: August 4, 2026
    Assignee: Cleveland-Cliffs Steel Properties Inc.
    Inventors: Miao Yu, Sobhan T. Nazari, Yu-Wei Wang
  • Patent number: D1142860
    Type: Grant
    Filed: November 6, 2024
    Date of Patent: August 18, 2026
    Assignee: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Ya-Chieh Lai, Chun-Yi Tu, Shi-Chen Lai, Meng-Chun Yen, Chih-An Lin, Yu-Wei Wang, Yi-Shan Chiang