Patents by Inventor Yuwen Shi

Yuwen Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparation method of the solid formulation of Clopidogrel bisulfate
    Patent number: 9144550
    Abstract: A solid formulation of clopidogrel bisulfate and its preparation method are disclosed. The formulation includes clopidogrel bisulfate as active ingredient, colloidal silicon dioxide as anti-adherent/coating and the carriers selected from diluent, binder, glidant, disintegrant and/or lubricant.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: September 29, 2015
    Assignee: Shanghai Anbison Laboratory Co., Ltd.
    Inventors: Jifeng Lei, Ping Sha, Ronggen Jin, Yuwen Shi, Xinhua Shen
  • Preparation Method Of The Solid Formulation Of Clopidogrel Bisulfate
    Publication number: 20150150815
    Abstract: A solid formulation of clopidogrel bisulfate and its preparation method are disclosed. The formulation includes clopidogrel bisulfate as active ingredient, colloidal silicon dioxide as anti-adherent/coating and the carriers selected from diluent, binder, glidant, disintegrant and/or lubricant.
    Type: Application
    Filed: February 5, 2015
    Publication date: June 4, 2015
    Inventors: Jifeng Lei, Ping Sha, Ronggen Jin, Yuwen Shi, Xinhua Shen
  • Preparation Method Of The Solid Formulation Of Clopidogrel Bisulfate
    Publication number: 20130011473
    Abstract: A solid formulation of clopidogrel bisulfate and its preparation method are disclosed. The formulation comprises clopidogrel bisulfate as active ingredient, colloidal silicon dioxide as anti-adherent/coating and the carriers selected from diluent, binder, glidant, disintegrant and/or lubricant.
    Type: Application
    Filed: August 6, 2012
    Publication date: January 10, 2013
    Inventors: Jifeng Lei, Ping Sha, Ronggen Jin, Yuwen Shi, Xinhua Shen
  • Ultra low-k dielectric materials
    Publication number: 20020132496
    Abstract: The invention relates to a dielectric composition and a process for forming an integrated circuit using the composition. The dielectric composition comprises a polymer precursor that upon heating to a cure temperature cross-links to form an organic polysilica layer and a sufficient amount of porogen that the layer has a porosity of from about 5% to about 80%. The porogen is non-reactive with the polymer precursor. Upon heating to a decomposition temperature, the porogen decomposes to form a gas that diffuses out of the layer.
    Type: Application
    Filed: February 8, 2002
    Publication date: September 19, 2002
    Inventors: Ian J. Ball, Qin Jang, Yuwen Shi