Abstract: The present disclosure provides use of Clostridium ghonii combined with a tumor angiogenesis inhibitor in preparing a pharmaceutical product for treating a tumor. The present disclosure further provides a drug for treating a tumor, where the drug includes active ingredients of Clostridium ghonii and a tumor angiogenesis inhibitor.

Abstract: The present disclosure relates to use of a Clostridium ghonii spore combined with pembrolizumab in cancer treatment. It is found for the first time that the Clostridium ghonii spore combined with pembrolizumab can significantly improve a curative effect of colon cancer and reduce a dose of the pembrolizumab, and thus is efficient and low-toxic. Oncolysis by Clostridium ghonii can affect immunogenicity of a tumor microenvironment (TME) by various ways, converts an immunosuppressive state of the TME into an immune-activated state, adjusts the immunosuppressive TME, and breaks an immune tolerance. An optimal combination of the Clostridium ghonii spore and the pembrolizumab thoroughly removes about 20% of mouse tumor tissues. A benefit range of patients with tumors treated by a PD-1 antibody is expanded. The combination even has an obvious curative effect on patients failed the treatment by the PD-1 antibody.

Abstract: The invention related to a one-pot process of making a single-phase silicone-acrylic hybrid adhesive composition comprising acrylic polymer and silicone polymer that are covalently bonded through a —Si—O—Si— linkage. The acrylic polymer contains at least one hydrolyzable silane (meth)acrylic monomer or siloxane (meth)acrylic macromer. These functional moieties provide reaction sites to form —Si—O—Si— bond by reacting hydrolyzable groups in the silicone polymer in the presence of a base or acid catalyst and water. The formed covalent bonds between the two incompatible systems of silicone polymer and acrylic polymer prevents phase separation and thereby a permanent, homogeneous single-phase system is formed.

Abstract: Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suitable as films or encapsulants for adhering electronic devices, e.g., LCD display, LED display, flexible display, touch screen, and flexible thin film photovoltaic module.

Abstract: Silicone optically clear adhesives compositions and films with pressure sensitive properties are described. The silicone optically clear adhesives compositions are thermal, UV curable, or UV-moisture dual curable. The silicone optically clear adhesives are suitable for sealing and bonding cover glasses, touch panels, diffusers, rigid compensators, heaters, and flexible films, polarizers and retarders in the optical display devices, and are particularly suitable in flexible and foldable displays.

Abstract: Moisture curable polyacrylate polymers with pedant moisture reactive silyl-functional groups bound to the polymer chain and compositions comprising the same polyacrylate polymers are provided. The polyacrylate polymers and the compositions cure by way of a condensation mechanism in the presence of moisture and a catalyst. The moisture curable polyacrylate polymers and compositions provide excellent resistance to automotive oil at high temperature and are particularly useful as sealants and gaskets in automotive powertrains.

Abstract: The present invention provides moisture curable network silicone polymers and compositions thereof, having improved resistance to automotive oil at high temperature. The network silicone polymers contain terminal moisture curable functional groups and a partially crosslinking structure that contains C—C—C linkage which separates the siloxane backbone from the moisture curable functional groups and prevent thermal decomposition of siloxane backbone.

Abstract: Optically clear adhesives (OCA) with UV blocking below 380 nm are described. The OCA comprise a UV blocking package of UV absorbers and hindered amine light stabilizers. The UV blocking package is suitable for a variety of OCA, including PIB-based OCA, styrenic block copolymer-based OCA, silicone-based OCA, or acrylic-based OCA. The OCA with UV blocking in the invention are particularly suitable as laminating films, tapes or encapsulants for adhering display electronic devices, e.g., LCD displays, LED displays, flexible and foldable displays, and touch screens.

Abstract: Silicone optically clear adhesives compositions and films with pressure sensitive properties are described. The silicone optically clear adhesives compositions are thermal, UV curable, or UV-moisture dual curable. The silicone optically clear adhesives are suitable for sealing and bonding cover glasses, touch panels, diffusers, rigid compensators, heaters, and flexible films, polarizers and retarders in the optical display devices, and are particularly suitable in flexible and foldable displays.

Abstract: Silicone optically clear adhesives compositions and films with pressure sensitive properties are described. The silicone optically clear adhesives compositions are thermal, UV curable, or UV-moisture dual curable. The silicone optically clear adhesives are suitable for sealing and bonding cover glasses, touch panels, diffusers, rigid compensators, heaters, and flexible films, polarizers and retarders in the optical display devices, and are particularly suitable in flexible and foldable displays.

Abstract: Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suitable as films or encapsulants for adhering electronic devices, e.g., LCD display, LED display, flexible display, touch screen, and flexible thin film photovoltaic module.

Abstract: Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suitable as films or encapsulants for adhering electronic devices, e.g., LCD display, LED display, flexible display, touch screen, and flexible thin film photovoltaic module.

Abstract: The invention related to a one-pot process of making a single-phase silicone-acrylic hybrid adhesive composition comprising acrylic polymer and silicone polymer that are covalently bonded through a —Si—O—Si— linkage. The acrylic polymer contains at least one hydrolyzable silane (meth)acrylic monomer or siloxane (meth)acrylic macromer. These functional moieties provide reaction sites to form —Si—O—Si— bond by reacting hydrolyzable groups in the silicone polymer in the presence of a base or acid catalyst and water. The formed covalent bonds between the two incompatible systems of silicone polymer and acrylic polymer prevents phase separation and thereby a permanent, homogeneous single-phase system is formed.

Abstract: The present invention provides moisture curable silicone polymers and compositions thereof, having improved resistance to automotive oil and high temperature. The silicone polymers contain terminal moisture curable functional groups and a linkage that separate the siloxane backbone from the moisture curable functional groups. The linkage confers oil resistance at elevated temperatures to the cured compositions. The silicone polymers and compositions cure by way of a condensation mechanism in the presence of moisture and a catalyst. The silicone polymers and compositions are particularly useful as sealants and gaskets in automotive powertrains.

Abstract: Optically clear adhesives (OCA) with UV blocking below 380 nm are described. The OCA comprise a UV blocking package of UV absorbers and hindered amine light stabilizers. The UV blocking package is suitable for a variety of OCA, including PIB-based OCA, styrenic block copolymer-based OCA, silicone-based OCA, or acrylic-based OCA. The OCA with UV blocking in the invention are particularly suitable as laminating films, tapes or encapsulants for adhering display electronic devices, e.g., LCD displays, LED displays, flexible and foldable displays, and touch screens.

Abstract: Silicone optically clear adhesives compositions and films with pressure sensitive properties are described. The silicone optically clear adhesives compositions are thermal, UV curable, or UV-moisture dual curable. The silicone optically clear adhesives are suitable for sealing and bonding cover glasses, touch panels, diffusers, rigid compensators, heaters, and flexible films, polarizers and retarders in the optical display devices, and are particularly suitable in flexible and foldable displays.

Abstract: Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Abstract: Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.

Abstract: Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suitable as films or encapsulants for adhering electronic devices, e.g., LCD display, LED display, flexible display, touch screen, and flexible thin film photovoltaic module.