Abstract: A sediment pressure-holding transfer device developed based on abyssal sediment fidelity sampler is disclosed, which uses a vacuum pump to discharge a gas in the device, uses a high-pressure pump as a power source to perform a pressurization process, uses gravity of a sample to perform a first transfer, and uses a high-pressure impurity pump and a safety valve to perform a second transfer of a sample mixture, in its structure, a high-pressure-resistant and corrosion-resistant material is used as a main material of the device, the device mainly comprises a mechanical system and a hydraulic system, the mechanical system is used as a main frame of the device and is a basis for ensuring operation of the device; the hydraulic system is used as a core of the device and is a key to ensure success of sediment transfer.

Abstract: A sediment pressure-holding transfer device developed based on abyssal sediment fidelity sampler is disclosed, which uses a vacuum pump to discharge a gas in the device, uses a high-pressure pump as a power source to perform a pressurization process, uses gravity of a sample to perform a first transfer, and uses a high-pressure impurity pump and a safety valve to perform a second transfer of a sample mixture, in its structure, a high-pressure-resistant and corrosion-resistant material is used as a main material of the device, the device mainly comprises a mechanical system and a hydraulic system, the mechanical system is used as a main frame of the device and is a basis for ensuring operation of the device; the hydraulic system is used as a core of the device and is a key to ensure success of sediment transfer.

Abstract: A method for preparing a porous metal material comprises: in a vacuum environment, volatilizing one or more volatile alloy elements in an alloy, so as to finally form a porous pure metal or a porous alloy. The process method can be widely applied in the fields such as aeronautics and astronautics, atomic energy, electrochemistry, petrochemical industry, metallurgy, machinery, medicines, environmental protection or construction.

Abstract: A heterosystem of two different materials, mismatched in terms of lattice constant or symmetry, may be formed with reduced defects by using a two step approach proposed in this invention. Nanowires are first grown on a semiconductor substrate, and then a thin film of the disparate crystallographically inconsistent material is grown from the nanowires through a two dimensional growth mode. The nanowire material may better match crystallographically to both the substrate and the grown film, or is simply the same as the grown film.

Abstract: A heterosystem of two different materials, mismatched in terms of lattice constant or symmetry, may be formed with reduced defects by using a two step approach proposed in this invention. Nanowires are first grown on a semiconductor substrate, and then a thin film of the disparate crystallographically inconsistent material is grown from the nanowires through a two dimensional growth mode. The nanowire material may better match crystallographically to both the substrate and the grown film, or is simply the same as the grown film.

Abstract: A semiconductor wafer scrubber has a brush with a nubless outer surface for cleaning the surfaces of a semiconductor wafer. The nubless brush has a body and rotates around a central axis as it contacts the wafer surface. The brush has a central section with an outer diameter less than the diameter of the end sections.

Abstract: A semiconductor wafer scrubber has a brush with a nubless outer surface for cleaning the surfaces of a semiconductor wafer. The nubless brush has a body and rotates around a central axis as it contacts the wafer surface. The brush has a central section with an outer diameter less than the diameter of the end sections.

Abstract: A semiconductor wafer scrubber has a brush with a nubless outer surface for cleaning the surfaces of a semiconductor wafer. The nubless brush has a body and rotates around a central axis as it contacts the wafer surface. The brush has a central section with an outer diameter less than the diameter of the end sections.