Patents by Inventor Yuya Dokai

Yuya Dokai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200235450
    Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.
    Type: Application
    Filed: April 9, 2020
    Publication date: July 23, 2020
    Inventors: Takahiro BABA, Yuya DOKAI
  • Patent number: 10673113
    Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: June 2, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Yuya Dokai
  • Patent number: 10517170
    Abstract: A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: December 24, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinya Oguri, Yuki Ito, Yuya Dokai, Isamu Morita
  • Patent number: 10373043
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: August 6, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
  • Publication number: 20190237841
    Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.
    Type: Application
    Filed: April 10, 2019
    Publication date: August 1, 2019
    Inventors: Takahiro BABA, Yuya DOKAI
  • Patent number: 10305531
    Abstract: A HF-band wireless communication device includes a wireless IC configured to process a radio signal, a first substrate including a first inductor pattern coupled to the wireless IC, and a second substrate which includes a coil-shaped second inductor pattern coupled in series to the first inductor pattern. An L value of the first inductor pattern is greater than an L value of the second inductor pattern, and the L value of the first inductor pattern is dominant in a resonant frequency of a resonance circuit including the first and second inductor patterns. A winding diameter of the second inductor pattern is greater than a winding diameter of the first inductor pattern, and the second inductor pattern defines a main radiating element.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: May 28, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiromi Murayama, Yuya Dokai
  • Patent number: 10305156
    Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: May 28, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Yuya Dokai
  • Patent number: 10235544
    Abstract: An RFID tag inspection method includes the steps of transmitting a measurement signal from a reader/writer simultaneously to a plurality of RFID tags arrayed on a collective base member and configured to process radio signals, receiving response waves from the individual RFID tags in a batch by the reader/writer, and determining, based on strengths and a number of received signals read by the reader/writer, whether or not the individual RFID tags are acceptable. Thus, acceptance/rejection inspection can be performed on the plural RFID tags, which are arrayed on the collective base member, in a batch.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: March 19, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tsuyoshi Mukai, Yuya Dokai
  • Publication number: 20190037685
    Abstract: A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.
    Type: Application
    Filed: October 2, 2018
    Publication date: January 31, 2019
    Inventors: Shinya OGURI, Yuki ITO, Yuya DOKAI, Isamu MORITA
  • Patent number: 9864943
    Abstract: A wireless communication device includes a wireless IC device, a multilayer substrate including a stack of a plurality of dielectric layers, a resonant circuit that is connected to the wireless IC device and that includes a capacitance element provided in the multilayer substrate and an inductance element provided outside the multilayer substrate, and a radiation conductor connected to the resonant circuit.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: January 9, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yuya Dokai
  • Patent number: 9830552
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: November 28, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
  • Publication number: 20170236049
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Application
    Filed: May 5, 2017
    Publication date: August 17, 2017
    Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
  • Publication number: 20170220920
    Abstract: A HF-band wireless communication device includes a wireless IC configured to process a radio signal, a first substrate including a first inductor pattern coupled to the wireless IC, and a second substrate which includes a coil-shaped second inductor pattern coupled in series to the first inductor pattern. An L value of the first inductor pattern is greater than an L value of the second inductor pattern, and the L value of the first inductor pattern is dominant in a resonant frequency of a resonance circuit including the first and second inductor patterns. A winding diameter of the second inductor pattern is greater than a winding diameter of the first inductor pattern, and the second inductor pattern defines a main radiating element.
    Type: Application
    Filed: April 12, 2017
    Publication date: August 3, 2017
    Inventors: Hiromi MURAYAMA, Yuya DOKAI
  • Patent number: 9697458
    Abstract: An antenna module includes an antenna element including coil patterns and via conductors coupling together two adjacent two coil patterns. At least one of the coil patterns has a spiral shape, is wound three or more turns parallel or substantially parallel to an outer edge of a principal surface of a multilayer body, includes a first partial pattern including an outer end portion, a second partial pattern extending parallel or substantially parallel with the first partial pattern and being adjacent to the first partial pattern with a first gap provided therebetween, and a third partial pattern extending parallel or substantially parallel with the second partial pattern and being adjacent to the second partial pattern with a second gap provided therebetween, the second gap being smaller than the first gap.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: July 4, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiromi Murayama, Yuya Dokai, Tsuyoshi Mukai, Kazuaki Higashibata, Masato Nomura, Noboru Kato
  • Publication number: 20170187087
    Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.
    Type: Application
    Filed: March 13, 2017
    Publication date: June 29, 2017
    Inventors: Takahiro BABA, Yuya DOKAI
  • Publication number: 20170147917
    Abstract: An antenna module includes an antenna element including coil patterns and via conductors coupling together two adjacent two coil patterns. At least one of the coil patterns has a spiral shape, is wound three or more turns parallel or substantially parallel to an outer edge of a principal surface of a multilayer body, includes a first partial pattern including an outer end portion, a second partial pattern extending parallel or substantially parallel with the first partial pattern and being adjacent to the first partial pattern with a first gap provided therebetween, and a third partial pattern extending parallel or substantially parallel with the second partial pattern and being adjacent to the second partial pattern with a second gap provided therebetween, the second gap being smaller than the first gap.
    Type: Application
    Filed: February 7, 2017
    Publication date: May 25, 2017
    Inventors: Hiromi MURAYAMA, Yuya DOKAI, Tsuyoshi MUKAI, Kazuaki HIGASHIBATA, Masato NOMURA, Noboru KATO
  • Patent number: 9634714
    Abstract: A HF-band wireless communication device includes a wireless IC configured to process a radio signal, a first substrate including a first inductor pattern coupled to the wireless IC, and a second substrate which includes a coil-shaped second inductor pattern coupled in series to the first inductor pattern. An L value of the first inductor pattern is greater than an L value of the second inductor pattern, and the L value of the first inductor pattern is dominant in a resonant frequency of a resonance circuit including the first and second inductor patterns. A winding diameter of the second inductor pattern is greater than a winding diameter of the first inductor pattern, and the second inductor pattern defines a main radiating element.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: April 25, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromi Murayama, Yuya Dokai
  • Patent number: 9607258
    Abstract: An antenna module includes an antenna element including coil patterns and via conductors coupling together two adjacent two coil patterns. At least one of the coil patterns has a spiral shape, is wound three or more turns parallel or substantially parallel to an outer edge of a principal surface of a multilayer body, includes a first partial pattern including an outer end portion, a second partial pattern extending parallel or substantially parallel with the first partial pattern and being adjacent to the first partial pattern with a first gap provided therebetween, and a third partial pattern extending parallel or substantially parallel with the second partial pattern and being adjacent to the second partial pattern with a second gap provided therebetween, the second gap being smaller than the first gap.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: March 28, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromi Murayama, Yuya Dokai, Tsuyoshi Mukai, Kazuaki Higashibata, Masato Nomura, Noboru Kato
  • Patent number: 9558440
    Abstract: An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: January 31, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo Ikemoto, Yuya Dokai, Noboru Kato
  • Publication number: 20160358064
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Application
    Filed: August 24, 2016
    Publication date: December 8, 2016
    Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI