Patents by Inventor Yuya Karakawa

Yuya Karakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module and electronic apparatus
    Patent number: 11818844
    Abstract: A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: November 14, 2023
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yuya Karakawa, Mitsutoshi Hasegawa, Takashi Aoki, Noritake Tsuboi
  • SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS
    Publication number: 20220386468
    Abstract: A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.
    Type: Application
    Filed: May 26, 2022
    Publication date: December 1, 2022
    Inventors: Yuya Karakawa, Mitsutoshi Hasegawa, Takashi Aoki, Noritake Tsuboi