Patents by Inventor Yuya MIKI

Yuya MIKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11692098
    Abstract: A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ?r of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C., and the polyamide resin composition satisfies the following equations: 50?c/(b+c)×100?70, and 10?(b+c)/(a+b+c)×100?40.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: July 4, 2023
    Assignee: UBE CORPORATION
    Inventors: Yuya Miki, Tetsuro Hiroki, Masayoshi Baba
  • Publication number: 20220325102
    Abstract: A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ?r of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C., and the polyamide resin composition satisfies the following equations: 50?c/(b+c)×100?70, and 10?(b+c)/(a+b+c)×100?40.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 13, 2022
    Inventors: Yuya MIKI, Tetsuro HIROKI, Masayoshi BABA
  • Publication number: 20210139699
    Abstract: A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes: a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ?r of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C.; wherein the polyamide resin composition satisfies the following equations: 50?c/(b+c)×100?70, and 10?(b+c)/(a+b+c)×100?40.
    Type: Application
    Filed: August 10, 2018
    Publication date: May 13, 2021
    Inventors: Yuya MIKI, Tetsuro HIROKI, Masayoshi BABA