Patents by Inventor Yuya Mizobe

Yuya Mizobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9552803
    Abstract: A communication method is provided. The communication method includes generating a pseudo background sound signal based on a gradient pulse control signal, performing a computation of subtracting the pseudo background sound signal from an acoustic signal having a sound signal and a background sound signal including a gradient coil drive sound signal, the acoustic signal obtained by an input device configured to receive the voice of a subject, and outputting sound based on a result of the computation, wherein a parameter of generating the pseudo background sound signal is controlled to reduce the difference resulting from the subtraction.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: January 24, 2017
    Assignee: General Electric Company
    Inventors: Yasuyuki Innami, Kiyoshi Murakami, Shohei Kimoto, Yuya Mizobe, Yusuke Asaba
  • Patent number: 9263313
    Abstract: A plasma processing apparatus is provided which includes a processing chamber disposed in a vacuum container, in a decompressed inside of which plasma is formed, a sample stage disposed in a lower part of the processing chamber, on a top surface of which a sample is mounted, a dielectric film made of a dielectric that forms a mounting surface on which the sample is mounted, and electrodes arranged inside the dielectric film and supplied with power for chucking and holding the sample onto the dielectric film, and when the sample is mounted on the sample stage, the sample is kept mounted on the sample stage until a sample temperature becomes a predetermined temperature or until a predetermined time elapses, and power is then supplied to the electrodes to chuck the sample to the sample stage and then start processing on the sample using the plasma.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: February 16, 2016
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Kohei Sato, Yuya Mizobe, Tomohiro Ohashi
  • Publication number: 20140295671
    Abstract: A plasma processing apparatus is provided which includes a processing chamber disposed in a vacuum container, in a decompressed inside of which plasma is formed, a sample stage disposed in a lower part of the processing chamber, on a top surface of which a sample is mounted, a dielectric film made of a dielectric that forms a mounting surface on which the sample is mounted, and electrodes arranged inside the dielectric film and supplied with power for chucking and holding the sample onto the dielectric film, and when the sample is mounted on the sample stage, the sample is kept mounted on the sample stage until a sample temperature becomes a predetermined temperature or until a predetermined time elapses, and power is then supplied to the electrodes to chuck the sample to the sample stage and then start processing on the sample using the plasma.
    Type: Application
    Filed: February 19, 2014
    Publication date: October 2, 2014
    Inventors: Kohei Sato, Yuya Mizobe, Tomohiro Ohashi
  • Patent number: 8366370
    Abstract: A vacuum processing apparatus includes a transfer container for transferring a wafer in the internal space thereof reduced in pressure, a vacuum vessel coupled to the side wall of the vacuum vessel and including a processing chamber having a sample stage therein on which a wafer to be processed is mounted, a lid member opened or closed by rotation above the vacuum vessel, an inner chamber member arranged in the vacuum vessel and making up the inner wall of the processing chamber, and a jig coupled to the side wall of the vacuum vessel to lift and hold the inner chamber member by being coupled thereto. The jig includes a first joint portion having vertical and horizontal shafts, an extensible arm portion rotatable around each shaft of the first joint portion, and a second joint portion with the inner chamber member adapted to rotate around the horizontal axis thereof.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: February 5, 2013
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Tsutomu Nakamura, Hidenobu Tanimura, Yuya Mizobe
  • Publication number: 20110176893
    Abstract: A vacuum processing apparatus includes a transfer container for transferring a wafer in the internal space thereof reduced in pressure, a vacuum vessel coupled to the side wall of the vacuum vessel and including a processing chamber having a sample stage therein on which a wafer to be processed is mounted, a lid member opened or closed by rotation above the vacuum vessel, an inner chamber member arranged in the vacuum vessel and making up the inner wall of the processing chamber, and a jig coupled to the side wall of the vacuum vessel to lift and hold the inner chamber member by being coupled thereto. The jig includes a first joint portion having vertical and horizontal shafts, an extensible arm portion rotatable around each shaft of the first joint portion, and a second joint portion with the inner chamber member adapted to rotate around the horizontal axis thereof.
    Type: Application
    Filed: February 25, 2010
    Publication date: July 21, 2011
    Inventors: Tsutomu NAKAMURA, Hidenobu Tanimura, Yuya Mizobe