Patents by Inventor Yuya OHASHI

Yuya OHASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250065845
    Abstract: A system is mounted on a vehicle and includes a sensor configured to perform a detection process that detects a fingerprint of a finger touching the sensor in order to perform a fingerprint authentication process, and a controller. The controller is configured to: (i) control a power supply of the vehicle to be ON when a predetermined authentication process through a predetermined communication with another device other than the sensor is successful, the predetermined authentication process being different from the fingerprint authentication process, and (ii) suppress the detection process that detects the fingerprint in response to the power supply of the vehicle being ON and the predetermined authentication process being successful.
    Type: Application
    Filed: November 14, 2024
    Publication date: February 27, 2025
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
    Inventors: Yasuhisa OHTA, Yuya GOTO, Naoyuki TAKADA, Takahiko ANDO, Yosuke OHASHI, Rijin OWAKI, Daisuke OGAWA
  • Publication number: 20250042362
    Abstract: A master communication device causes a slave communication device connected to the master communication device to perform a distance measurement communication for measuring a distance between a terminal and a vehicle that wirelessly communicates with the terminal. The master communication device notifies a controller connected to the master communication device of a first result of the distance measurement communication performed by the slave communication device. The master communication device further notifies the controller of a second result of the distance measurement communication performed by the master communication device. The vehicle is permitted to be actuated in response to any one of the first result or the second result indicating that the distance is valid.
    Type: Application
    Filed: October 23, 2024
    Publication date: February 6, 2025
    Applicant: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
    Inventors: Masateru FURUTA, Yosuke OHASHI, Tetsuya KOBAYASHI, Yuya GOTO, Satoshi OZAWA
  • Publication number: 20210382080
    Abstract: With an analyzer capable of carrying out a plurality of kinds of analyses, the device is suppressed from being increased in size. The analyzer includes a first measurement unit for holding a cuvette to which a biological sample is dispensed, and performing a first measurement of a content of the cuvette; a second measurement unit for holding a cuvette, and performing a second measurement different from the first measurement of the content of the cuvette; and a transport unit for gripping the cuvette, and transporting the cuvette to an attachment and detachment position of the first measurement unit or an attachment and detachment position of the second measurement unit. The transport unit moves along a guide rail, and the attachment and detachment position of the first measurement unit and the attachment and detachment position of the second measurement unit are provided on a line substantially along the guide rail.
    Type: Application
    Filed: October 10, 2019
    Publication date: December 9, 2021
    Inventors: Masatoshi ISHIGURO, Miyuki AZUMA, Norihito OTA, Fumitaka ABE, Masami KOJIMA, Masamichi MORIYA, Yuichi SHITARA, Yuya OHASHI, Tetsuya HORI
  • Patent number: 9666509
    Abstract: One embodiment provides a semiconductor device having a first chip for lowering an input voltage and a second chip for performing signal processing, mounted on a die pad. Lead terminals are divided into a first lead row and a second lead row. The first lead row are connected with the first chip, the first chip are connected with the second chip or the second lead row, and the second chip are connected with the second lead row. A distance between the lead terminals of the first lead row is set longer than a distance between the lead terminals of the second lead row, and a sealing resin is provided to fill at least between the lead terminals of the first lead row.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: May 30, 2017
    Assignee: New Japan Radio Co., Ltd.
    Inventors: Yuya Ohashi, Jun Yamashita, Yoshio Fujii, Kohei Shirokura
  • Publication number: 20160211200
    Abstract: One embodiment provides a semiconductor device having a first chip for lowering an input voltage and a second chip for performing signal processing, mounted on a die pad. Lead terminals are divided into a first lead row and a second lead row. The first lead row are connected with the first chip, the first chip are connected with the second chip or the second lead row, and the second chip are connected with the second lead row. A distance between the lead terminals of the first lead row is set longer than a distance between the lead terminals of the second lead row, and a sealing resin is provided to fill at least between the lead terminals of the first lead row.
    Type: Application
    Filed: January 5, 2016
    Publication date: July 21, 2016
    Inventors: Yuya OHASHI, Jun YAMASHITA, Yoshio FUJII, Kohei SHIROKURA