Abstract: The present invention aims to provide a microcapsule composition that enables reduction or prevention of injury of useful plants caused by pyroxasulfone, a production method therefor, an agrochemical formulation containing the same, and a weed control method. A method of producing a microcapsule composition containing pyroxasulfone encapsulated therein, the method including: an emulsifying dispersion step of performing high-speed stirring of pyroxasulfone crystal particles, isocyanate, oily phase, and aqueous phase at a peripheral speed of 6.000 to 30,000 mm/s to allow emulsifying dispersion of the oily phase in the aqueous phase, to form emulsion particles of the oily phase; and a film formation step of forming a film on at least the surface of the emulsion particles of the oily phase formed by the emulsifying dispersion step; and the like are provided.

Abstract: An image pickup unit includes: a printed wiring board provided with an image pickup element and having a first electrode on a surface layer; a flexible wiring substrate having a base member having first and second faces, a conductive layer provided on the first face, and an insulating layer provided on the conductive layer, wherein the conductive layer has a second electrode in which the insulating layer is not provided to one longitudinal end part; a conductive connection member that connects the first electrode to the second electrode; and a reinforcement member provided on the base member on the second face side, wherein the reinforcement member continuously covers an end part of the insulating layer on a side closer to the second electrode and an end part of the conductive connection member on a side closer to the insulating layer of a portion connected to the second electrode.

Abstract: An imaging unit includes: an imaging sensor module having a printed wiring board on which an imaging element is provided; a flexible printed circuit board connected to a connecting portion of the printed wiring board; an elastic member provided on a face having the connecting portion of the printed wiring board; and an image stabilization unit having a fixing portion that fixes the flexible printed circuit board, the imaging sensor module is movable with respect to the image stabilization unit, and the elastic member holds the flexible printed circuit board.

Abstract: An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.

Abstract: An in-mold foamed molded product unit may include an in-mold foamed molded product made of a thermoplastic resin, and an insert material. At least a portion of the insert material may be embedded in the in-mold foamed molded product. The insert material may have a frame-like shape that is substantially rectangular shape and includes a first set of opposite sides and a second set of opposite sides. A portion of the insert material that corresponds to the first set of opposite sides may be a first extending portion, and a portion of the insert material that corresponds to the second set of opposite sides may be a second extending portion. The first extending portion may be substantially entirely embedded in the in-mold foamed molded product, and the second extending portion may include an exposed portion that is exposed to the outside of the in-mold foamed molded product.

Abstract: Provided is a uniaxially stretched multi-layer laminate film including a first layer and a second layer alternately laminated each other, wherein the first layer is a layer containing a polyester, the polyester containing an ethylene naphthalate unit in an amount of 50 mol % or more and 100 mol % or less on a basis of a repeating unit that constitutes the polyester, and a polymer that forms the second layer is a copolymer polyester containing, as copolymer components, a 2,6-naphthalenedicarboxylic acid component, an ethylene glycol component, and a trimethylene glycol component, (A) the content of an ethylene naphthalate unit in the polyester of the first layer being 80 mol % or more and 100 mol % or less on a basis of the repeating unit that constitutes the polyester, or (B) the polymer that forms the second layer being the copolymer polyester further containing, as a copolymer component, an alicyclic diol component.

Abstract: Provided is a uniaxially stretched multi-layer laminate film including a first layer and a second layer alternately laminated each other, wherein the first layer is a layer containing a polyester, the polyester containing an ethylene naphthalate unit in an amount of 50 mol % or more and 100 mol % or less on a basis of a repeating unit that constitutes the polyester, and a polymer that forms the second layer is a copolymer polyester containing, as copolymer components, a 2,6-naphthalenedicarboxylic acid component, an ethylene glycol component, and a trimethylene glycol component, (A) the content of an ethylene naphthalate unit in the polyester of the first layer being 80 mol % or more and 100 mol % or less on a basis of the repeating unit that constitutes the polyester, or (B) the polymer that forms the second layer being the copolymer polyester further containing, as a copolymer component, an alicyclic diol component.

Abstract: Provided is a noise reduction device including: a conductive bar of conductive material extending through a through hole in a metal housing to the outside; a magnetic material core of magnetic material disposed at a peripheral edge of the conductive bar; a substrate attached to the conductive bar so as to be adjacent to the magnetic material core; a capacitor mounted on the substrate and having a first terminal connected to the conductive bar and a second terminal connected to an inner wall of the through hole; and a blocking unit blocking an opening of the through hole so as to affix the conductive bar to the metal housing. The magnetic material core, the substrate, and the capacitor are disposed in the through hole blocked by the blocking unit; and the conductive bar has an outer end that functions as an output terminal.

Abstract: Provided is a noise reduction device including: a conductive bar of conductive material; a metal tubular portion with a through hole having the conductive bar penetrating therethrough and accommodating a magnetic material core and a substrate therein; a capacitor mounted on the substrate and having a first terminal connected to the conductive bar and a second terminal connected to an inner wall of the through hole; and a blocking unit blocking an opening of the through hole so as to affix the conductive bar with respect to the metal housing and the tubular portion. The tubular portion includes an outer peripheral surface having a threaded engagement part threadedly engaged with the metal housing; and the conductive bar has an outer end that functions as an output terminal.

Abstract: Provided is a noise reduction device including: a conductive bar of conductive material extending through a through hole in a metal housing to the outside; a magnetic material core of magnetic material disposed at a peripheral edge of the conductive bar; a substrate attached to the conductive bar so as to be adjacent to the magnetic material core; a capacitor mounted on the substrate and having a first terminal connected to the conductive bar and a second terminal connected to an inner wall of the through hole; and a blocking unit blocking an opening of the through hole so as to affix the conductive bar to the metal housing. The magnetic material core, the substrate, and the capacitor are disposed in the through hole blocked by the blocking unit; and the conductive bar has an outer end that functions as an output terminal.

Abstract: Provided is a noise reduction device including: a conductive bar of conductive material; a metal tubular portion with a through hole having the conductive bar penetrating therethrough and accommodating a magnetic material core and a substrate therein; a capacitor mounted on the substrate and having a first terminal connected to the conductive bar and a second terminal connected to an inner wall of the through hole; and a blocking unit blocking an opening of the through hole so as to affix the conductive bar with respect to the metal housing and the tubular portion. The tubular portion includes an outer peripheral surface having a threaded engagement part threadedly engaged with the metal housing; and the conductive bar has an outer end that functions as an output terminal.

Abstract: A stacked semiconductor device includes a first semiconductor package and a second semiconductor package stacked thereon, and further includes a plate member interposed between the first semiconductor package and the second semiconductor package. The plate member has a plate body, protruding strips protruding toward its edges from the plate body, and leg portions respectively provided on the protruding strips. Each of the leg portions is disposed on a surface, which opposes one surface of a wiring substrate, of the protruding strip, and contacts the one surface of the wiring substrate. Thus, defective connection of connecting terminals due to warping of the wiring substrate and loading inclination of the first semiconductor package is reduced, resulting in an improved yield.

Abstract: Provided is a semiconductor device in which a semiconductor element mounted on a wiring substrate is placed in a hollow portion, the hollow portion being formed by the wiring substrate, a protective member, and a wall member, with the wiring substrate, the protective member, and the wall member being a bottom surface, a top surface, and side surfaces thereof, respectively. The wall member has a vent hole provided therein, which communicates the hollow portion to/from the outside, and the vent hole includes a pillar member formed of a material having a linear expansion coefficient which is smaller than that of the wall member. Therefore, airtightness of the hollow portion is maintained to prevent entry of foreign matters at ordinary temperature, and vapor pressure in the hollow portion is relieved when heated.

Abstract: A stator frame is disclosed having a substantially annular conductor plate, a connector receiving member, a plurality of wire connecting members, and a substantially annular insulating stator frame housing. The conductor plate has an inner peripheral edge defining an O-shaped opening. The connector receiving member is positioned on an outer peripheral side of the stator frame. The wire connecting members are positioned on a conductor plate surface of the conductor plate along the inner peripheral edge, each wire connecting member being connected to first or second end portions of stator windings, and having an electrical connection with the connector receiving member. The stator frame housing is mounted to a stator, and covers the conductor plate except for the conductor plate surface the wire connecting members are positioned thereon.

Abstract: A electrical connector for a motor is disclosed having a connector receiving member, a first connector, and a seal assembly. The connector receiving member is disposed on an outer peripheral portion of a stator supporting frame, the stator supporting frame being connected to a stator or a motor housing. The first connector has a first mating portion that mates with the connector receiving member. The seal assembly is positioned in a space between the motor housing and the first mating portion.

Abstract: A stacked semiconductor device includes a first semiconductor package and a second semiconductor package stacked thereon, and further includes a plate member interposed between the first semiconductor package and the second semiconductor package. The plate member has a plate body, protruding strips protruding toward its edges from the plate body, and leg portions respectively provided on the protruding strips. Each of the leg portions is disposed on a surface, which opposes one surface of a wiring substrate, of the protruding strip, and contacts the one surface of the wiring substrate. Thus, defective connection of connecting terminals due to warping of the wiring substrate and loading inclination of the first semiconductor package is reduced, resulting in an improved yield.

Abstract: Provided is a multilayered semiconductor device, including: a first semiconductor package including a first semiconductor element and a first wiring board; a second semiconductor package including: a second semiconductor element, a second wiring board and a first encapsulating resin for encapsulating the second semiconductor element therein; and a plate member disposed between the first semiconductor package and the second semiconductor package, the first semiconductor package, the plate member, and the second semiconductor package being stacked in this order, in which the first wiring board and the second wiring board are electrically connected to each other via a metal wire through one of a notch and an opening formed in the plate member and the first semiconductor element, the second semiconductor package, and the metal wire are encapsulated in a second encapsulating resin.

Abstract: Provided is a semiconductor device in which a semiconductor element mounted on a wiring substrate is placed in a hollow portion, the hollow portion being formed by the wiring substrate, a protective member, and a wall member, with the wiring substrate, the protective member, and the wall member being a bottom surface, a top surface, and side surfaces thereof, respectively. The wall member has a vent hole provided therein, which communicates the hollow portion to/from the outside, and the vent hole includes a pillar member formed of a material having a linear expansion coefficient which is smaller than that of the wall member. Therefore, airtightness of the hollow portion is maintained to prevent entry of foreign matters at ordinary temperature, and vapor pressure in the hollow portion is relieved when heated.

Abstract: Provided is a multilayered semiconductor device, including: a first semiconductor package including a first semiconductor element and a first wiring board; a second semiconductor package including: a second semiconductor element, a second wiring board and a first encapsulating resin for encapsulating the second semiconductor element therein; and a plate member disposed between the first semiconductor package and the second semiconductor package, the first semiconductor package, the plate member, and the second semiconductor package being stacked in this order, in which the first wiring board and the second wiring board are electrically connected to each other via a metal wire through one of a notch and an opening formed in the plate member and the first semiconductor element, the second semiconductor package, and the metal wire are encapsulated in a second encapsulating resin.