Patents by Inventor Yuya OKIMURA

Yuya OKIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220411630
    Abstract: A resin composition including a polyester polyurethane resin (A); and an epoxy resin (B), in which a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to 8,000, and a layered body including a resin composition layer, a layered body, a flexible copper-clad laminate, a flexible flat cable, or an electromagnetic wave shielding film, each using the resin composition.
    Type: Application
    Filed: November 25, 2020
    Publication date: December 29, 2022
    Inventors: Masahiro TORII, Yuya OKIMURA, Hironori KUTSUNA, Makoto HIRAKAWA, Masashi YAMADA
  • Publication number: 20220306859
    Abstract: Provided are: a resin composition, containing a polyester polyurethane resin (A), an epoxy resin (B), and a polyamide resin (C); as well as a bonding film, a layered body including a resin composition layer, a layered body, and an electromagnetic wave shielding film, each using the resin composition.
    Type: Application
    Filed: April 15, 2020
    Publication date: September 29, 2022
    Inventors: Yuya OKIMURA, Masahiro TORII, Makoto HIRAKAWA, Masashi YAMADA
  • Publication number: 20220259427
    Abstract: Provided are: a resin composition, containing a polyester polyurethane resin (A), an epoxy resin (B), and a polyolefin resin (C); as well as a layered body including a resin composition layer, a layered body, and an electromagnetic wave shielding film, each using the resin composition.
    Type: Application
    Filed: June 23, 2020
    Publication date: August 18, 2022
    Inventors: Yuya OKIMURA, Masahiro TORII, Makoto HIRAKAWA, Masashi YAMADA
  • Publication number: 20210009865
    Abstract: Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a resin obtained by graft modifying an unmodified polypropylene-based resin (D) with a modifying agent that contains an ?,?-unsaturated carboxylic acid or a derivative thereof, the content of the modified polypropylene-based resin (A) being 10 mass % or more in terms of solid content, and the content of the unmodified polypropylene-based resin (C) being 1-90 mass % in terms of solid content. The adhesive composition exhibits good adhesion to a copper foil or a base material film comprising a polyimide resin or the like, and exhibits improved dielectric properties.
    Type: Application
    Filed: March 1, 2019
    Publication date: January 14, 2021
    Inventors: Yuya OKIMURA, Makoto HIRAKAWA, Masashi YAMADA
  • Patent number: 10875283
    Abstract: A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: December 29, 2020
    Assignee: TOAGOSEI CO., LTD.
    Inventors: Yuya Okimura, Masashi Yamada
  • Patent number: 10471682
    Abstract: An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: November 12, 2019
    Assignee: TOAGOSEI CO., LTD.
    Inventors: Yuya Okimura, Masashi Yamada
  • Patent number: 10472496
    Abstract: The flame-retardant adhesive composition contains a styrene-based elastomer containing a carboxyl group, an epoxy resin, and a phosphorus-containing oligomer including a structural unit represented by general formula (1), and the epoxy resin content is 1-20 parts by mass and the phosphorus-containing oligomer content is 10-50 parts by mass with respect to 100 parts by mass of the styrene-based elastomer containing carboxyl groups. (wherein, R1 and R2 are each independently a hydrogen atom or a methyl group, n is an integer of 1-20.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: November 12, 2019
    Assignee: TOAGOSEI CO., LTD.
    Inventors: Masaru Takashima, Yuya Okimura, Masashi Yamada
  • Publication number: 20170297302
    Abstract: An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided.
    Type: Application
    Filed: August 7, 2015
    Publication date: October 19, 2017
    Inventors: Yuya OKIMURA, Masashi YAMADA
  • Publication number: 20170259544
    Abstract: A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.
    Type: Application
    Filed: July 21, 2015
    Publication date: September 14, 2017
    Inventors: Yuya OKIMURA, Masashi YAMADA
  • Publication number: 20160222192
    Abstract: The flame-retardant adhesive composition contains a styrene-based elastomer containing a carboxyl group, an epoxy resin, and a phosphorus-containing oligomer including a structural unit represented by general formula (1), and the epoxy resin content is 1-20 parts by mass and the phosphorus-containing oligomer content is 10-50 parts by mass with respect to 100 parts by mass of the styrene-based elastomer containing carboxyl groups. (wherein, R1 and R2 are each independently a hydrogen atom or a methyl group, n is an integer of 1-20.
    Type: Application
    Filed: September 8, 2014
    Publication date: August 4, 2016
    Applicant: TOAGOSEI CO., LTD.
    Inventors: Masaru TAKASHIMA, Yuya OKIMURA, Mesashi YAMADA