Patents by Inventor Yuya Otsuka

Yuya Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128020
    Abstract: In a method for manufacturing a laminated coil component, in which a laminated coil component is manufactured by laminating insulator sheets in order on which conductors having predetermined patterns are formed, the insulator sheets are laminated such that a distance in a lamination direction between a first lead-out conductor laminated first and a first coil conductor laminated next is larger than a distance in the lamination direction between a second lead-out conductor laminated last and a second coil conductor laminated immediately before the second lead-out conductor.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 18, 2024
    Applicant: TDK CORPORATION
    Inventors: Yuya OSHIMA, Junichi OTSUKA, Yohei TADAKI, Shinichi KONDO, Koki ITO, Yoji TOZAWA, Shigeshi OSAWA, Tsubasa OZAWA, Makoto YOSHINO
  • Patent number: 11655394
    Abstract: Polishing liquid comprising abrasive grains, a phosphonic acid compound having a molecular weight of 210 or more, and at least one selected from the group consisting of amino acids and amino acid derivatives, in which a silanol group density of the abrasive grains is 6.5 groups/nm2 or less, and a degree of association of the abrasive grains is 1.5 or more.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: May 23, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Yuya Otsuka, Tomohiro Iwano
  • Publication number: 20230054199
    Abstract: An aspect of the present disclosure provides a CMP polishing liquid containing: abrasive grains; and a cationic polymer, in which the cationic polymer has a main chain containing a nitrogen atom and a carbon atom and a hydroxyl group bonded to the carbon atom. The CMP polishing liquid may further contain at least one cyclic compound selected from the group consisting of an amino group-containing aromatic compound and a nitrogen-containing heterocyclic compound. Another aspect of the present disclosure provides a polishing method including a step of polishing a material to be polished by using this CMP polishing liquid.
    Type: Application
    Filed: February 12, 2021
    Publication date: February 23, 2023
    Inventors: Shingo KOBAYASHI, Hisataka MINAMI, Yuya OTSUKA, Mayumi KOMINE, Jenna WU, Hisato TAKAHASHI
  • Patent number: 11584868
    Abstract: A polishing liquid for polishing a surface to be polished containing cobalt, the polishing liquid containing abrasive grains, at least one sugar component selected from the group consisting of a sugar alcohol, a sugar alcohol derivative, and a polysaccharide, an acid component, and water, in which a pH of the polishing liquid is more than 8.0.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: February 21, 2023
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Shunsuke Kondo, Yuya Otsuka, Mayumi Komine, Keisuke Inoue
  • Patent number: 11526128
    Abstract: A duct for guiding air outside an image forming apparatus to a charging device includes: a first flow passage; a second flow passage bent from the first flow passage and extending in a direction orthogonal to a rotational direction and a rotational axis direction of a photosensitive drum, the second flow passage being provided with an outlet; and a plurality of flow dividing plates provided in the second flow passage, the plurality of flow dividing plates being disposed in parallel along the rotational axis direction and forming a third flow passage between the flow dividing plates adjacent to each other, in which a relationship between a length in the orthogonal direction and a length in the rotational axis direction of the third flow passage is a predetermined relationship.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: December 13, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yuya Otsuka, Hiroki Sato, Ryuichi Kojima
  • Publication number: 20220276606
    Abstract: A second duct 50 for guiding air outside an image forming apparatus A to a charging device 2 includes: a first flow passage 50c; a second flow passage 50d bent from the first flow passage 50c and extending in a direction orthogonal to a rotational direction and a rotational axis direction of a photosensitive drum, the second flow passage 50d being provided with an outlet 50b; and a plurality of flow dividing plates 60 provided in the second flow passage 50d, the plurality of flow dividing plates 60 being disposed in parallel along the rotational axis direction and forming a third flow passage between the flow dividing plates 60 adjacent to each other, in which a relationship between a length in the orthogonal direction and a length in the rotational axis direction of the third flow passage is a predetermined relationship.
    Type: Application
    Filed: February 4, 2022
    Publication date: September 1, 2022
    Inventors: Yuya Otsuka, Hiroki Sato, Ryuichi Kojima
  • Publication number: 20220251422
    Abstract: A polishing liquid containing: abrasive grains containing a metal oxide; at least one hydroxy acid compound selected from the group consisting of a hydroxy acid having a structure represented by General Formula (A1) below and a salt thereof; and water: [In the formula, R11 represents a hydrogen atom or a hydroxy group, R12 represents a hydrogen atom, an alkyl group, or an aryl group, n11 represents an integer of 0 or more, and n12 represents an integer of 0 or more; however, a case where both of R11 and R12 are a hydrogen atom is excluded.
    Type: Application
    Filed: June 6, 2019
    Publication date: August 11, 2022
    Inventors: Yuya OTSUKA, Hisataka MINAMI, Shingo KOBAYASHI, Mayumi KOMINE, Hisato TAKAHASHI
  • Patent number: 11359114
    Abstract: A polishing method includes polishing a substrate with a CMP polishing liquid. The substrate includes a barrier metal, a metal film, and a silicon dioxide film. The metal film includes one or more of copper, copper alloy, copper oxide, or copper alloy oxide. The CMP polishing liquid includes abrasive particles, a metal oxide dissolving agent, an oxidizing agent, a water-soluble polymer, and an alkali metal ion. The pH of the CMP polishing liquid is 7.0 to 11.0. Surface potentials of the abrasive particles and the metal film have the same sign and a product of the surface potential (mV) of the abrasive particles and the surface potential (mV) of the metal film is 300 to 980 mV2 upon polishing the substrate with the CMP polishing liquid.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: June 14, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Keisuke Inoue, Shunsuke Kondo, Yuya Otsuka
  • Publication number: 20210253906
    Abstract: A polishing liquid for polishing a surface to be polished containing cobalt, the polishing liquid containing abrasive grains, at least one sugar component selected from the group consisting of a sugar alcohol, a sugar alcohol derivative, and a polysaccharide, an acid component, and water, in which a pH of the polishing liquid is more than 8.0.
    Type: Application
    Filed: June 13, 2019
    Publication date: August 19, 2021
    Inventors: Shunsuke KONDO, Yuya OTSUKA, Mayumi KOMINE, Keisuke INOUE
  • Publication number: 20210189179
    Abstract: The present invention relates to a CMP polishing liquid for polishing a substrate comprising at least a barrier metal, a metal film, and a silicon dioxide film or a substrate comprising at least a barrier metal, a metal film, a silicon dioxide film, and a low-k film, wherein: the polishing liquid contains abrasive particles, a metal oxide dissolving agent, an oxidizing agent, a water-soluble polymer, and an alkali metal ion; the surface potentials of the abrasive particles and the metal film upon polishing have the same sign and the product of the surface potential (mV) of the abrasive particles and the surface potential (mV) of the metal film is 250 to 10000; and pH is 7.0 to 11.0.
    Type: Application
    Filed: March 10, 2021
    Publication date: June 24, 2021
    Inventors: Keisuke INOUE, Shunsuke KONDO, Yuya OTSUKA
  • Publication number: 20200369917
    Abstract: Polishing liquid comprising abrasive grains, a phosphonic acid compound having a molecular weight of 210 or more, and at least one selected from the group consisting of amino acids and amino acid derivatives, in which a silanol group density of the abrasive grains is 6.5 groups/nm2 or less, and a degree of association of the abrasive grains is 1.5 or more.
    Type: Application
    Filed: August 9, 2017
    Publication date: November 26, 2020
    Inventors: Yuya OTSUKA, Tomohiro IWANO
  • Publication number: 20200369918
    Abstract: Provided is a method for polishing an article including a Co-containing portion to be polished by a polishing liquid, in which the polishing liquid contains water, abrasive particles, and a metal dissolving agent, a pH of the polishing liquid is 6.0 or more, and a content of hydrogen peroxide in the polishing liquid is 0.0001% by mass or less based on the total mass of the polishing liquid.
    Type: Application
    Filed: August 8, 2017
    Publication date: November 26, 2020
    Inventors: Shunsuke KONDO, Keisuke INOUE, Mayumi OUCHI, Yuya OTSUKA
  • Publication number: 20190256741
    Abstract: The present invention relates to a CMP polishing liquid for polishing a substrate comprising at least a barrier metal, a metal film, and a silicon dioxide film or a substrate comprising at least a barrier metal, a metal film, a silicon dioxide film, and a low-k film, wherein: the polishing liquid contains abrasive particles, a metal oxide dissolving agent, an oxidizing agent, a water-soluble polymer, and an alkali metal ion; the surface potentials of the abrasive particles and the metal film upon polishing have the same sign and the product of the surface potential (mV) of the abrasive particles and the surface potential (mV) of the metal film is 250 to 10000; and pH is 7.0 to 11.0.
    Type: Application
    Filed: June 9, 2017
    Publication date: August 22, 2019
    Inventors: Keisuke INOUE, Shunsuke KONDO, Yuya OTSUKA
  • Patent number: 9310764
    Abstract: An image forming apparatus includes: an image forming portion; a first housing; a fixing device; a second housing; a first opening of the first housing facing a space; a second opening of the second housing facing the space; a first air supply fan that supplies air from the outside; a first air discharge fan that discharges air from the inside; a second air supply fan that supplies air from the outside; and a second air discharge fan that discharges air from the inside. The first housing and the second housing communicate with the atmosphere through the first and second openings, respectively. When the air pressure in the first opening of the first housing is P1 and the air pressure in the second opening of the second housing is P2, a relation of P2<P1 is satisfied.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: April 12, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yuya Otsuka
  • Publication number: 20150153710
    Abstract: An image forming apparatus includes: an image forming portion; a first housing; a fixing device; a second housing; a first opening of the first housing facing a space, a second opening of the second housing facing the space; a first air supply fan that supplies air from the outside, a first air discharge fan that discharges air from the inside, a second air supply fan that supplies air from the outside, and a second air discharge fan that discharges air from the inside. The first housing and the second housing communicate with the atmosphere through the first and second openings, respectively. When an air pressure of in the first opening of the first housing is P1 and an air pressure of in the second opening of the second housing is P2, a relation of P2<P1 is satisfied.
    Type: Application
    Filed: November 21, 2014
    Publication date: June 4, 2015
    Inventor: Yuya Otsuka
  • Publication number: 20060168986
    Abstract: An object is to provide a beverage supply device which can cool cooling water in a water tank provided with a beverage cooling pipe by use of a cooling unit using a refrigerant having little influence on global environment, a beverage dispenser is provided with the beverage cooling pipe (syrup cooling pipe, diluting water cooling pipe, carbonated water cooling pipe) disposed in the water tank to store cooling water, the water tank being cooled by an evaporation pipe, the beverage dispenser passes syrup, diluting water, and carbonated water as beverage ingredients through the beverage cooling pipe to extract beverage, and the beverage dispenser comprises: a cooling unit in which a compressor, a radiator, a capillary tube, the evaporation pipe and the like are connected to one another via a pipe to constitute a refrigerant circuit and which is filled with carbon dioxide as the refrigerant.
    Type: Application
    Filed: February 1, 2006
    Publication date: August 3, 2006
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Kazuhide Saitoh, Yuya Otsuka, Takeo Igarashi, Naoyuki Shiraishi, Akira Goitsuka, Masahiro Kamiyama