Abstract: A substrate processing apparatus includes: a plurality of roller pairs configured to place a plurality of substrates, respectively, wherein the substrates are arranged side by side in a horizontal direction with a predetermined interval, and rotate the plurality of substrates, respectively, in a circumferential direction; a first, second, and third circulation groove that are disposed along outer peripheral portions of each of the plurality of substrates; a chemical solution supplier configured to supply a chemical solution to the outer peripheral portions of the plurality of substrates through the first circulation groove; a rinse solution supplier configured to supply a rinse solution to the outer peripheral portions of the plurality of substrates through the second circulation groove; and a fluid supplier configured to supply a fluid for drying the rinse solution to the outer peripheral portions of the plurality of substrates through the third circulation groove.

Abstract: The inkjet printing apparatus is configured to be able to execute a batch adjustment process of performing a plurality of times of adjustment processes related to printing in succession based on one instruction from an outside. The conveyance control unit maintains the conveyance speed at a first speed in a period when a chart printing process is performed and a period when a chart imaging process is performed. The conveyance control unit decreases the conveyance speed from the first speed to the second speed after the end of the chart imaging process in an adjustment process except for an adjustment process that is performed last in the batch adjustment process, and increases the conveyance speed from the second speed to the first speed before the start of the chart printing process in an adjustment process that is performed next.

Abstract: In a printing apparatus, a colorimeter is provided for performing imaging calibration on an inline scanner for inspecting a printed image. During a printing operation, the inline scanner captures a test pattern image formed on paper and thereby obtains calibration imaging data, the colorimeter performs color measurement on the test pattern image and thereby obtains calibration colorimetric data, both data are used to update a correction factor LUT for imaging calibration, and the correction factor LUT is used to perform imaging calibration on the inline scanner.

Abstract: In a printing apparatus, a colorimeter is provided for performing imaging calibration on an inline scanner for inspecting a printed image. During a printing operation, the inline scanner captures a test pattern image formed on paper and thereby obtains calibration imaging data, the colorimeter performs color measurement on the test pattern image and thereby obtains calibration colorimetric data, both data are used to update a correction factor LUT for imaging calibration, and the correction factor LUT is used to perform imaging calibration on the inline scanner.

Abstract: A multilayer ceramic electronic component includes a laminated body, and first and second external electrodes respectively provided on first and second end surfaces of the laminated body. The laminated body includes an inner layer portion in which the first and second internal electrode layers oppose each other with the dielectric ceramic layers interposed therebetween, and outer layer portions sandwiching the inner layer portion in the lamination direction and a side margin portion sandwiching the inner layer portion and the outer layer portions in the width direction. The side margin portion is defined by ceramic layers laminated in the width direction, and includes, as the ceramic layers, an inner layer on an innermost side of the laminated body and an outer layer on an outermost side of the laminated body.

Abstract: A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.

Abstract: A multilayer ceramic electronic component includes a laminated body, and first and second external electrodes respectively provided on first and second end surfaces of the laminated body. The laminated body includes an inner layer portion in which the first and second internal electrode layers oppose each other with the dielectric ceramic layers interposed therebetween, and outer layer portions sandwiching the inner layer portion in the lamination direction and a side margin portion sandwiching the inner layer portion and the outer layer portions in the width direction. The side margin portion is defined by ceramic layers laminated in the width direction, and includes, as the ceramic layers, an inner layer on an innermost side of the laminated body and an outer layer on an outermost side of the laminated body.

Abstract: A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.