Abstract: An alert system includes a display device, a display control unit, and a target recognition unit. The display control unit: when the number of targets recognized by the target recognition unit is equal to or more than an upper limit number, sets a display range of a surrounding icon as a whole circular area; and in a state where the number of targets is equal to or more than the upper limit number and the display range of the surrounding icon is set as the whole circular area, when the number of targets increases, reduces the size of the surrounding icon.

Abstract: A semiconductor device may include coolers, semiconductor modules, and a pair of connecting pipes. The coolers are arranged in a line and each of which includes a first flow path. Each of the semiconductor modules is interposed between a corresponding pair of the coolers. Each of the connecting pipes communicates with the adjacent coolers. A pair of coolant holes may be provided at one of the coolers located at one end in the stacking direction. A pair of second flow paths may extend respectively from the coolant holes to one of the coolers located at other end in the stacking direction. A bolt-head retainer and an internally threaded portion may be provided in each second flow path, the bolt-head retainer retaining a head of a bolt, and the internally threaded portion fixing the bolt. The coolers between the bolt-lead retainers and the internally threaded portions are fixed by the bolts.

Abstract: A semiconductor device may include coolers, semiconductor modules, and a pair of connecting pipes. The coolers are arranged in a line and each of which includes a first flow path. Each of the semiconductor modules is interposed between a corresponding pair of the coolers. Each of the connecting pipes communicates with the adjacent coolers. A pair of coolant holes may be provided at one of the coolers located at one end in the stacking direction. A pair of second flow paths may extend respectively from the coolant holes to one of the coolers located at other end in the stacking direction. A bolt-head retainer and an internally threaded portion may be provided in each second flow path, the bolt-head retainer retaining a head of a bolt, and the internally threaded portion fixing the bolt. The coolers between the bolt-lead retainers and the internally threaded portions are fixed by the bolts.

Abstract: A cooler includes: a fin having a coolant inflow port; and a nozzle configured to eject the supplied coolant toward the coolant inflow port. The nozzle includes a flow passage wall, a tip end, a pressure receiving portion and a deformation portion. The tip end provides a coolant supply hole that ejects the coolant flowing through the flow passage. The pressure receiving portion is configured to be provided between the flow passage wall and the coolant supply hole, and to receive force in an ejection direction of the coolant. The deformation portion is configured to be provided either of between the flow passage wall and the pressure receiving portion and in the pressure receiving portion, and to displace the coolant supply hole in the ejection direction of the coolant in response to the force in the ejection direction of the coolant, the force being received by the pressure receiving portion.

Abstract: A semiconductor device includes a stacked unit having a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler that has a second opening and a second coolant flow path that is connected to the second opening, and being formed by the first cooler and the second cooler sandwiching the semiconductor module and being stacked such that the first opening and the second opening face each other; a seal member that is arranged between the first opening and the second opening that are adjacent in a stacking direction, and that connect the first opening and the second opening; and a winding member that keeps pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit.

Abstract: A cooler (1) includes: a fin (20) having a coolant inflow port (110a); and a nozzle (10) configured to eject the supplied coolant toward the coolant inflow port (110a). The nozzle (10) includes a flow passage wall (13), a tip end (14), a pressure receiving portion (16) and a deformation portion (15). The tip end (14) provides a coolant supply hole (12) that ejects the coolant flowing through the flow passage. The pressure receiving portion (16) is configured to be provided between the flow passage wall (13) and the coolant supply hole (12), and to receive force in an ejection direction of the coolant. The deformation portion (15) is configured to be provided either of between the flow passage wall (13) and the pressure receiving portion (16) and in the pressure receiving portion (16), and to displace the coolant supply hole (12) in the ejection direction of the coolant in response to the force in the ejection direction of the coolant, the force being received by the pressure receiving portion (16).

Abstract: A semiconductor device includes a stacked unit having a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler that has a second opening and a second coolant flow path that is connected to the second opening, and being formed by the first cooler and the second cooler sandwiching the semiconductor module and being stacked such that the first opening and the second opening face each other; a seal member that is arranged between the first opening and the second opening that are adjacent in a stacking direction, and that connect the first opening and the second opening; and a winding member that keeps pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit.

Abstract: In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions formed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.

Abstract: Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.

Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.

Abstract: A reservation method of computer resources having short idle periods is provided. A schedule management method includes: a terminal; computers that perform tasks; and a schedule management server that manages the allocation of the computers. Each computer includes a virtual machine monitor that manages virtual computers. The schedule management server includes a schedule management part that manages reservation information including reservation state of each virtual computer, and creates reservation schedules for allocating the virtual computers to the tasks.

Abstract: A method of manufacturing a flat type heat pipe, having an inside of which partitioned into a plurality of cells, that is capable of flexibly setting a concentration of working fluid in each cell is provided. The method includes processes of preparing a flat container, pouring, and closing. In the preparing, the flat container having the inside of which two-dimensionally partitioned into the plurality of cells is prepared. The flat container has connecting holes through which adjacent cells communicate and an inlet hole for the working fluid to be poured from outside. In the pouring, the working fluid is poured into respective cells through the inlet hole and the connecting holes. In the closing, the inlet hole and the connecting holes are closed. In one method, after sealing a specified cell, following processes of heating, removing air, pouring, evaporating, and closing are repeated for other cells.

Abstract: In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions ormed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.

Abstract: A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.

Abstract: It is an object of the present invention to provide a lighting device including a plurality of light guide bodies in which brightness difference between light guide bodies is reduced. A backlight unit 12 according to the present invention includes a plurality of LEDs 17 as light sources and a plurality of light guide bodies 31 each having a light entrance surface 31a and a light exit surface 31b. The light entrance surface faces the light source and through which light emitted from the light source enters the light guide body. The light in the light guide body exits through the light exit surface. The light guide bodies 31 are collectively covered with a fixing member 32, so that a positional relationship between the light guide bodies 31 is constant. Further, the fixing member 32 has a relative refractive index of one or less with respect to the light guide body 31.

Abstract: A light source unit in which color reproduction range is widened and uneven brightness and color unevenness are less likely to occur is provided. The light source unit includes light source sets 21 each of which includes a first light source 22 and a second light source, and an LED board 27 on which the sets 21 are arranged. The first source 22 includes a first LED chip 23 configured to emit at least a color of light of red, green or blue and phosphors excited by the light to emit light, colors of which are different from the color of the light from the chip 23. The second source 26 is configured to emit at least a color of light of cyan, magenta or yellow. The first source 22A in one of the adjacent sets and the second source 26B in another one of the adjacent sets are arranged adjacent to each other in an arrangement direction in which the adjacent sets are arranged.

Abstract: In a backlight unit, light from a light source is easily transmitted to a surface of a light guide plate opposite to a light entrance surface. A backlight unit 24 of the present technology includes an LED unit 32, a light guide plate 20 having a light entrance surface 20a on the side surface thereof and a light collecting member 38. The light collecting member 38 is provided between the LED unit 32 and the light entrance surface 20a and collects light from the LED unit 32 in a thickness direction of the light guide plate 20. The light collecting member 28 directs light from the LED unit 32 to the light entrance surface 20a effectively. Furthermore, the light collecting member 28 prevents light entering from the light entrance surface 20a from being dispersed in the thickness direction of the light guide plate 20 therein. Accordingly, light from the LED unit 32 is likely to be totally reflected within the light guide plate 20.

Abstract: In a lighting device including a chassis housing a reflection sheet, the reflection sheet is reliably positioned with respect to the chassis and overcomes a flexure or wrinkle from the reflection sheet. In an edge light-type backlight unit 24, a reflection sheet 26 has a reflection sheet-side recess 26s on a first side 26a close to an LED unit 32 and a reflection sheet projected portion 26t on second sides 26b perpendicular to the first side 26a. A backlight chassis 22 has a chassis-side recess 22s and a chassis-side projected portion 22t projecting toward a surface opposite to a light exit surface of a light guide plate 20 and having a projected top surface facing the opposite surface. The reflection sheet-side recess 26t is fitted to the chassis-side projected portion 22s with a gap therebetween and the chassis-side recess 22t is fitted to the reflection sheet-side projected portion 26s with a gap therebetween.

Abstract: A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger, the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space, the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.

Abstract: Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.