Patents by Inventor Yuya Touke

Yuya Touke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate plating method and apparatus
    Patent number: 7918983
    Abstract: A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: April 5, 2011
    Assignee: Ebara Corporation
    Inventors: Yasuhiko Saijo, Keisuke Hayabusa, Masanori Hayase, Yuya Touke
  • Substrate plating method and apparatus
    Publication number: 20070227894
    Abstract: A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a surface to be plated of a substrate includes carrying out first plating on the surface to be plated in a plating solution containing a plating accelerator as an additive, carrying out plating accelerator removal processing by bringing a remover, having the property of removing or decreasing the plating accelerator adsorbed on the plating surface, into contact with the plating surface, and then carrying out second plating on the plating surface at a constant electric potential.
    Type: Application
    Filed: March 26, 2007
    Publication date: October 4, 2007
    Inventors: Yasuhiko Saijo, Keisuke Hayabusa, Masanori Hayase, Yuya Touke