Patents by Inventor Yuya TSUCHIHASHI

Yuya TSUCHIHASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10843223
    Abstract: A substrate processing method includes a rinse liquid supplying step of supplying a rinse liquid containing water to a major surface of a substrate, a rotating step of rotating the substrate around a rotation axis passing through a central portion of the major surface of the substrate, and a hydrophobizing agent supplying step of supplying a hydrophobizing agent containing a first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the hydrophobizing agent in parallel with the rotating step after the rinse liquid supplying step is performed, and the hydrophobizing agent supplying step includes a hydrophobizing agent discharging step of discharging a continuous flow of the hydrophobizing agent from a discharge port of a nozzle toward the major surface of the substrate held by a substrate holding unit with a Reynolds number at the discharge port being not more than 1500.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: November 24, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Takayoshi Tanaka, Tetsuya Emoto, Akira Oato, Yuta Nakano, Teppei Nakano, Takashi Akiyama, Yuya Tsuchihashi, Reo Tamura, Atsuro Eitoku, Tomomi Iwata
  • Patent number: 10786836
    Abstract: A substrate processing method includes a chemical liquid supplying step of supplying a chemical liquid to a substrate, an elapsed period measuring step of measuring an after-the-end elapsed period, a recovery step of controlling the switching unit to be in a recovery guiding state, when, at a start of the chemical liquid supplying step, the after-the-end elapsed period is less than a predetermined first period, and a draining step of controlling the switching unit to be in a drain guiding state, in which the liquid led to the recovery space is led to the drain line, when, at the start of the chemical liquid supplying step, the after-the-end elapsed period is not less than the predetermined first period and then switching to the recovery guiding state based on establishment of a predetermined draining ending condition.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: September 29, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Atsuyasu Miura, Kazuhiro Fujita, Hiroki Tsujikawa, Yuya Tsuchihashi, Kenji Takemoto
  • Patent number: 10658203
    Abstract: A substrate processing apparatus includes a guard that catches liquid scattered outward from a spin chuck, a cup defining a liquid receiving groove to catch liquid that is guided downward by the guard, a guard elevating/lowering unit that moves the guard in an up/down direction, a cleaning liquid supplying unit that supplies cleaning liquid, discharged from a cleaning liquid nozzle, to the liquid receiving groove via the spin chuck and the guard, a cleaning liquid draining unit that drains the cleaning liquid in the liquid receiving groove, and a controller that controls the cleaning liquid supplying unit and the cleaning liquid draining unit to accumulate cleaning liquid in the liquid receiving groove and controls the guard elevating/lowering unit to cause a lower end portion of the cylindrical portion to be immersed in the cleaning liquid in the liquid receiving groove.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: May 19, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Hiroki Tsujikawa, Masahide Ikeda, Atsuyasu Miura, Kazuhiro Fujita, Yuya Tsuchihashi
  • Publication number: 20200144081
    Abstract: A substrate processing method includes a liquid discharging step of discharging liquid through a nozzle toward a predetermined supply region on the main surface of a substrate held on a substrate holding unit within a chamber, a humidified gas supplying step of supplying humidified gas with a humidity higher than the humidity within the chamber onto the main surface of the substrate to remove electrical charges carried on the substrate, and a spin-drying step of rotating the substrate about a predetermined rotational axis after the liquid discharging step to spin off the liquid component from the main surface of the substrate. The humidified gas supplying step is started before the start of the liquid discharging step and ended at a predetermined termination timing after the start of the liquid discharging step and before the spin-drying step.
    Type: Application
    Filed: April 17, 2018
    Publication date: May 7, 2020
    Inventors: Hiroki TSUJIKAWA, Masato TANAKA, Tsuyoshi OKUMURA, Atsuyasu MIURA, Makoto TAKAOKA, Nobuyuki MIYAJI, Kazuhiro FUJITA, Naoki SAWAZAKI, Takashi AKIYAMA, Yuya TSUCHIHASHI
  • Patent number: 10639683
    Abstract: A recover piping cleaning method is a method of cleaning a recovery piping into which a chemical liquid used for processing of a substrate is led via a processing cup, the recovery piping being arranged to lead the led chemical liquid into a predetermined chemical liquid recovery piping, the method including a piping cleaning step of cleaning the interior of the recovery piping by using a cleaning liquid by, while supplying the cleaning liquid to the recovery piping, leading the liquid led into the recovery piping into a drain piping which is different from the chemical liquid recovery piping, and a cleaning chemical liquid supplying step of, supplying the cleaning chemical liquid from a cleaning chemical liquid supply piping connected to the recovery piping to the recovery piping while leading the liquid led into the recovery piping into the drain piping.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: May 5, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yuya Tsuchihashi, Atsuyasu Miura, Hiroki Tsujikawa, Kazuhiro Fujita, Masahide Ikeda
  • Patent number: 10622225
    Abstract: The controller of a substrate processing apparatus carries out a liquid column forming step in which cleaning liquid is discharged through a lower surface nozzle when a spin chuck is not holding a substrate, to form a liquid column extending upward from the lower surface nozzle, and, in parallel with the liquid column forming step, a first dropping portion cleaning step in which an upper surface nozzle is reciprocated horizontally between a first position where a dropping portion of the upper surface nozzle does not contact the liquid column and a second position where the dropping portion of the upper surface nozzle does not contact the liquid column, so as to cause the upper surface nozzle to pass through a first middle position where the upper discharge port of the upper surface nozzle overlaps with the liquid column in a plan view.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: April 14, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Atsuyasu Miura, Masahide Ikeda, Hiroki Tsujikawa, Kazuhiro Fujita, Yuya Tsuchihashi
  • Patent number: 10199243
    Abstract: A substrate processing method is a substrate processing method which applies sequentially common etching processing which is common to each of a plurality of substrates. The common etching processing has an etching step and a high-temperature liquid discharge step. The substrate processing method further includes a piping heating step in which, of the plurality of common etching processings applied to the plurality of substrates, before the initial common etching processing, the pipe wall of the common piping is raised in temperature up to a predetermined second liquid temperature higher than a first liquid temperature and in each of the common etching processings, after each of high-temperature liquid discharge steps and before each of next etching steps, there is not performed a step in which the pipe wall of the common piping is lowered in temperature.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: February 5, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Kazuhiro Fujita, Atsuyasu Miura, Hiroki Tsujikawa, Yuya Tsuchihashi, Akihiko Taki
  • Publication number: 20180345315
    Abstract: A substrate processing method includes a rinse liquid supplying step of supplying a rinse liquid containing water to a major surface of a substrate, a rotating step of rotating the substrate around a rotation axis passing through a central portion of the major surface of the substrate, and a hydrophobizing agent supplying step of supplying a hydrophobizing agent containing a first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the hydrophobizing agent in parallel with the rotating step after the rinse liquid supplying step is performed, and the hydrophobizing agent supplying step includes a hydrophobizing agent discharging step of discharging a continuous flow of the hydrophobizing agent from a discharge port of a nozzle toward the major surface of the substrate held by a substrate holding unit with a Reynolds number at the discharge port being not more than 1500.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 6, 2018
    Inventors: Takayoshi TANAKA, Tetsuya EMOTO, Akira OATO, Yuta NAKANO, Teppei NAKANO, Takashi AKIYAMA, Yuya TSUCHIHASHI, Reo TAMURA, Atsuro EITOKU, Tomomi IWATA
  • Publication number: 20180158698
    Abstract: A substrate processing method is a substrate processing method which applies sequentially common etching processing which is common to each of a plurality of substrates. The common etching processing has an etching step and a high-temperature liquid discharge step. The substrate processing method further includes a piping heating step in which, of the plurality of common etching processings applied to the plurality of substrates, before the initial common etching processing, the pipe wall of the common piping is raised in temperature up to a predetermined second liquid temperature higher than a first liquid temperature and in each of the common etching processings, after each of high-temperature liquid discharge steps and before each of next etching steps, there is not performed a step in which the pipe wall of the common piping is lowered in temperature.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 7, 2018
    Inventors: Kazuhiro Fujita, Atsuyasu Miura, Hiroki Tsujikawa, Yuya Tsuchihashi, Akihiko Taki
  • Publication number: 20180085795
    Abstract: A recover piping cleaning method is a method of cleaning a recovery piping into which a chemical liquid used for processing of a substrate is led via a processing cup, the recovery piping being arranged to lead the led chemical liquid into a predetermined chemical liquid recovery piping, the method including a piping cleaning step of cleaning the interior of the recovery piping by using a cleaning liquid by, while supplying the cleaning liquid to the recovery piping, leading the liquid led into the recovery piping into a drain piping which is different from the chemical liquid recovery piping, and a cleaning chemical liquid supplying step of, supplying the cleaning chemical liquid from a cleaning chemical liquid supply piping connected to the recovery piping to the recovery piping while leading the liquid led into the recovery piping into the drain piping.
    Type: Application
    Filed: September 20, 2017
    Publication date: March 29, 2018
    Inventors: Yuya TSUCHIHASHI, Atsuyasu MIURA, Hiroki TSUJIKAWA, Kazuhiro FUJITA, Masahide IKEDA
  • Publication number: 20180061678
    Abstract: The controller of a substrate processing apparatus carries out a liquid column forming step in which cleaning liquid is discharged through a lower surface nozzle when a spin chuck is not holding a substrate, to form a liquid column extending upward from the lower surface nozzle, and, in parallel with the liquid column forming step, a first dropping portion cleaning step in which an upper surface nozzle is reciprocated horizontally between a first position where a dropping portion of the upper surface nozzle does not contact the liquid column and a second position where the dropping portion of the upper surface nozzle does not contact the liquid column, so as to cause the upper surface nozzle to pass through a first middle position where the upper discharge port of the upper surface nozzle overlaps with the liquid column in a plan view.
    Type: Application
    Filed: August 7, 2017
    Publication date: March 1, 2018
    Inventors: Atsuyasu MIURA, Masahide IKEDA, Hiroki TSUJIKAWA, Kazuhiro FUJITA, Yuya TSUCHIHASHI
  • Publication number: 20180029089
    Abstract: A substrate processing method includes a chemical liquid supplying step of supplying a chemical liquid to a substrate, an elapsed period measuring step of measuring an after-the-end elapsed period, a recovery step of controlling the switching unit to be in a recovery guiding state, when, at a start of the chemical liquid supplying step, the after-the-end elapsed period is less than a predetermined first period, and a draining step of controlling the switching unit to be in a drain guiding state, in which the liquid led to the recovery space is led to the drain line, when, at the start of the chemical liquid supplying step, the after-the-end elapsed period is not less than the predetermined first period and then switching to the recovery guiding state based on establishment of a predetermined draining ending condition.
    Type: Application
    Filed: July 21, 2017
    Publication date: February 1, 2018
    Inventors: Atsuyasu MIURA, Kazuhiro FUJITA, Hiroki TSUJIKAWA, Yuya TSUCHIHASHI, Kenji TAKEMOTO
  • Publication number: 20180025922
    Abstract: A substrate processing apparatus includes a guard that catches liquid scattered outward from a spin chuck, a cup defining a liquid receiving groove to catch liquid that is guided downward by the guard, a guard elevating/lowering unit that moves the guard in an up/down direction, a cleaning liquid supplying unit that supplies cleaning liquid, discharged from a cleaning liquid nozzle, to the liquid receiving groove via the spin chuck and the guard, a cleaning liquid draining unit that drains the cleaning liquid in the liquid receiving groove, and a controller that controls the cleaning liquid supplying unit and the cleaning liquid draining unit to accumulate cleaning liquid in the liquid receiving groove and controls the guard elevating/lowering unit to cause a lower end portion of the cylindrical portion to be immersed in the cleaning liquid in the liquid receiving groove.
    Type: Application
    Filed: July 13, 2017
    Publication date: January 25, 2018
    Inventors: Hiroki TSUJIKAWA, Masahide IKEDA, Atsuyasu MIURA, Kazuhiro FUJITA, Yuya TSUCHIHASHI