Patents by Inventor Yuyun Lou

Yuyun Lou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding for semiconductor devices
    Patent number: 11901327
    Abstract: A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: February 13, 2024
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yang Lei, Xiaofeng Di, Yuyun Lou, Zhonghua Qian, Junrong Yan
  • Wire Bonding For Semiconductor Devices
    Publication number: 20220052014
    Abstract: A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.
    Type: Application
    Filed: February 26, 2021
    Publication date: February 17, 2022
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yang Lei, Xiaofeng Di, Yuyun Lou, Zhonghua Qian, Junrong Yan