Patents by Inventor Yuzi Kuramitsu

Yuzi Kuramitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing a cooled electronic assembly
    Patent number: 4685211
    Abstract: Cooling equipment for use in electronic systems of type having a substrate with a plurality of heat-generating electronic components mounted thereon is disclosed. A hat assembly is provided having a plurality of cavities in which pistons can be slidably mounted. The hat assembly is placed adjacent to the substrate such that the pistons are next to the components. The pistons are then adjusted and fixed in the hat assembly so that a desired gap is maintained between the pistons and the components. A cooling plate is attached to the assembly.
    Type: Grant
    Filed: July 3, 1986
    Date of Patent: August 11, 1987
    Assignee: NEC Corporation
    Inventors: Takashi Hagihara, Yuzi Kuramitsu
  • Cooling equipment for an integrated circuit chip
    Patent number: 4628990
    Abstract: Cooling equipment for use in electronic systems of type having a substrate with a plurality of heat-generating electronic components mounted thereon is disclosed. A hat assembly is provided having a plurality of cavities in which pistons can be slidably mounted. The hat assembly is placed adjacent to the substrate such that the pistons are next to the components. The pistons are then adjusted and fixed in the hat assembly so that a desired gap is maintained between the pistons and the components. A cooling plate is attached to the assembly.
    Type: Grant
    Filed: August 9, 1985
    Date of Patent: December 16, 1986
    Assignee: NEC Corporation
    Inventors: Takashi Hagihara, Yuzi Kuramitsu