Patents by Inventor Yuzi Niino

Yuzi Niino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered
    Patent number: 4057825
    Abstract: A semiconductor device has a composite metal heat-radiating plate consisting of, for example, two copper layers for serving as a thermally and electrically conducting medium and an iron layer for giving mechanical strength, interposed between the copper layers, in which the semiconductor element is directly or indirectly, electrically and mechanically coupled by soldering to one of the copper layers.
    Type: Grant
    Filed: July 1, 1976
    Date of Patent: November 8, 1977
    Assignee: Hitachi, Ltd.
    Inventors: Kazutoyo Narita, Tadashi Sakaue, Yuzi Niino