Abstract: A method of manufacturing spherical silica particles comprising the steps of processing in an acid-containing solution and then washing with water the coagulant derived from an aqueous alkali metal silicate solution extruded through pores in a water-miscible organic medium or acid solution, wet-grinding the amorphous silica thus obtained in a liquid dispersion medium to obtain a fine particle silica suspension with a weight average particle size of 10 .mu.m or less, spray-drying this fine particle silica suspension with hot air and sintering the spherical granulated silica thus obtained. According to the present invention, the high-purity spherical silica particles can be obtained with high solidity and adjusted surface smoothness without any complicated operation or waste water treatment for use as a sealant filler for highly-integrated IC electronic parts.