Patents by Inventor Yuzo Iwasaki

Yuzo Iwasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate structure, method of mounting semiconductor chip, and solid state relay
    Patent number: 9245829
    Abstract: This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. On a substrate, a semiconductor chip is mounted via solder paste. The substrate is provided with a groove portion which continuously or discontinuously surrounds the solder paste.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: January 26, 2016
    Assignee: OMRON Corporation
    Inventors: Shintaro Hara, Shoichi Konagata, Yuzo Iwasaki, Tomonori Shiraishi
  • SUBSTRATE STRUCTURE, METHOD OF MOUNTING SEMICONDUCTOR CHIP, AND SOLID STATE RELAY
    Publication number: 20140077375
    Abstract: This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. On a substrate, a semiconductor chip is mounted via solder paste. The substrate is provided with a groove portion which continuously or discontinuously surrounds the solder paste.
    Type: Application
    Filed: July 23, 2013
    Publication date: March 20, 2014
    Applicant: OMRON CORPORATION
    Inventors: Shintaro Hara, Shoichi Konagata, Yuzo Iwasaki, Tomonori Shiraishi
  • Solid-state relay
    Patent number: 4745311
    Abstract: A solid-state relay having a photo-coupler for controlling supply of AC power to a load is improved so as to eliminate the problem of counterelectromotive force which could happen when the load contains an inductive component and the power to the load is turned off.
    Type: Grant
    Filed: May 1, 1987
    Date of Patent: May 17, 1988
    Assignee: Omron Tateisi Electronics Co.
    Inventor: Yuzo Iwasaki