Patents by Inventor Yuzo Kozai

Yuzo Kozai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad and apparatus for polishing a semiconductor wafer
    Patent number: 6077153
    Abstract: An apparatus for polishing a semiconductor wafer includes a polishing pad to be in contact with the semiconductor wafer; a turn table which rotates the polishing pad; and an elastic member which is arranged between the turn table and the polishing pad. The polishing pad includes a polishing layer which is made of a material having a good characteristic of slurry holding; and a support layer which is made of a rigid material having an optimum thickness to prevent the polishing layer from loosening. The polishing pad is attached to the turn table by a stretch-holding technique without adhesive bonding.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: June 20, 2000
    Assignee: Sumitomo Metal Industries, Limited
    Inventors: Takashi Fujita, Yuzo Kozai, Motoyuki Ohara