Patents by Inventor Yuzo MORISAKI

Yuzo MORISAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for curing resin composition
    Patent number: 10427394
    Abstract: The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: October 1, 2019
    Assignee: OMRON Corporation
    Inventors: Seiji Nakajima, Yosuke Tatsuno, Mitsuo Ito, Satoshi Hirono, Yuzo Morisaki, Junji Kawamoto
  • Resin composition and cured product thereof
    Patent number: 10138348
    Abstract: The present invention provides a resin composition which can be cured in a short time without a heat load on an adherend and with which a cured product having stable quality can be obtained. The resin composition in accordance with the present invention contains (i) a bisphenol A epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: November 27, 2018
    Assignee: OMRON CORPORATION
    Inventors: Seiji Nakajima, Yosuke Tatsuno, Mitsuo Ito, Satoshi Hirono, Yuzo Morisaki, Junji Kawamoto
  • METHOD FOR CURING RESIN COMPOSITION
    Publication number: 20170066230
    Abstract: The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.
    Type: Application
    Filed: November 6, 2014
    Publication date: March 9, 2017
    Applicant: OMRON CORPORATION
    Inventors: Seiji NAKAJIMA, Yosuke TATSUNO, Mitsuo ITO, Satoshi HIRONO, Yuzo MORISAKI, Junji KAWAMOTO
  • RESIN COMPOSITION AND CURED PRODUCT THEREOF
    Publication number: 20170066899
    Abstract: The present invention provides a resin composition which can be cured in a short time without a heat load on an adherend and with which a cured product having stable quality can be obtained. The resin composition in accordance with the present invention contains (i) a bisphenol A epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.
    Type: Application
    Filed: November 6, 2014
    Publication date: March 9, 2017
    Applicant: OMRON CORPORATION
    Inventors: Seiji NAKAJIMA, Yosuke TATSUNO, Mitsuo ITO, Satoshi HIRONO, Yuzo MORISAKI, Junji KAWAMOTO