Patents by Inventor Yuzo Shimobeppu

Yuzo Shimobeppu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip removing and conveying method and device
    Patent number: 6461942
    Abstract: Semiconductor chips are formed on a wafer. The wafer is diced, while a dicing tape applied to the wafer is kept intact. Each of the semiconductor chips is fixed by suction and then removed from the dicing tape. Each of the semiconductor chips is unfixed by ceasing the suction and picked up and conveyed.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: October 8, 2002
    Assignee: Fujitsu Limited
    Inventors: Mitsuhisa Watanabe, Kazuo Teshirogi, Eiji Yoshida, Yuzo Shimobeppu, Yoshito Konno, Kyouhei Tamaki
  • Semiconductor chip removing and conveying method and device
    Publication number: 20010049160
    Abstract: Semiconductor chips are formed on a wafer. The wafer is diced, while a dicing tape applied to the wafer is kept intact. Each of the semiconductor chips is fixed by suction and then removed from the dicing tape. Each of the semiconductor chips is unfixed by ceasing the suction and picked up and conveyed.
    Type: Application
    Filed: December 26, 2000
    Publication date: December 6, 2001
    Applicant: FUJITSU LIMITED
    Inventors: Mitsuhisa Watanabe, Kazuo Teshirogi, Eiji Yoshida, Yuzo Shimobeppu, Yoshito Konno, Kyouhei Tamaki