Abstract: Provided are a light-transmitting laminate that, even when formed in a short period of time, satisfies the adhesiveness and light transmittance of a high refractive index thin film; and a method for producing the light-transmitting laminate. A light-transmitting laminate (10) has a metal thin film layer (16), a high refractive index thin film layer (14) that has a refractive index higher than that of the metal thin film layer (16), and a light-transmitting substrate (12) in this order. The high refractive index thin film layer (14) contains a leveling agent and a high refractive index polymer that has a functional group having at least one element selected from N, O, and S, and the content of the leveling agent is in the range of 0.20-20.32 parts by mass per 100 parts by mass of the high refractive index polymer.

Abstract: Disclosed is a light transmitting laminate for optical use that is excellent in adhesion and workability. The light transmitting laminate for optical use contains a polyolefin layer and a thin film layer made of a metal layer or a metal oxide layer. The metal layer is made of at least one selected from silver, a silver alloy, aluminum, an aluminum alloy, iron, and an iron alloy. The metal oxide layer is made of at least one selected from an indium tin oxide, an indium zinc oxide, a zinc oxide, a tin oxide, an aluminum zinc oxide, a gallium zinc oxide, and an indium gallium zinc oxide. The thin film layer is formed by sputtering. The polyolefin layer contains on both surfaces thereof silica particles.

Abstract: An organic semiconductor device includes a laminate and films sealing the laminate in which excellent connection precision is achieved between connection lands and electrodes by suppression of slipping between the laminate and the films upon sealing of the laminate under evacuation, and the laminate is highly sealed. The organic semiconductor device has, between a laminate and a first film substrate, an antislip members that suppress slipping between the laminate and the first film substrate upon sealing of the laminate. An open hole and an electrode contained in the laminate are kept aligned by suppressing of the slipping. The electrode contained in the laminate is connected outside the device through the open hole by a conductive material.