Abstract: Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a cleaning unit, and a path block disposed between the indexer block and the treating block. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the path block.

Abstract: Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a cleaning unit, and a path block disposed between the indexer block and the treating block. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the path block.

Abstract: Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a front face cleaning unit and a back face cleaning unit as treating units, and a reversing path block including a plurality of shelves on which substrates are placed, and having a reversing function. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the reversing path block.

Abstract: Disclosed is a substrate treating apparatus that performs a cleaning treatment on substrates. A treating block includes a plurality of treating units in an upper and lower stages, respectively. The treating block includes a front face cleaning unit and a back face cleaning unit, each being at least one in number, in the upper stage. The treating block includes at least one tower unit including the front face cleaning unit and the back face cleaning unit, each being at least one in number, in the lower stage. Moreover, a transportation block is provided that includes a center robot in each of the upper and lower stages.

Abstract: Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a front face cleaning unit and a back face cleaning unit as treating units, and a reversing path block including a plurality of shelves on which substrates are placed, and having a reversing function. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the reversing path block.

Abstract: Disclosed is a substrate treating apparatus that performs a cleaning treatment on substrates. A treating block includes a plurality of treating units in an upper and lower stages, respectively. The treating block includes a front face cleaning unit and a back face cleaning unit, each being at least one in number, in the upper stage. The treating block includes at least one tower unit including the front face cleaning unit and the back face cleaning unit, each being at least one in number, in the lower stage. Moreover, a transportation block is provided that includes a center robot in each of the upper and lower stages.

Abstract: A second control device of a second substrate processing apparatus determines whether the processing-start expected time for a substrate is equal to or earlier than a processing-start time limit. If the processing-start expected time is equal to or earlier than the processing-start time limit, the second control device allows the second substrate processing apparatus to execute a first schedule and a second schedule that are initial schedules. On the other hand, if the processing-start expected time is later than the processing-start time limit, the second control device changes the initial first schedule and the initial second schedule so that the processing-start expected time becomes equal to or earlier than the processing-start time limit, and the second control device allows the second substrate processing apparatus to execute the first schedule and the second schedule that have been changed.

Abstract: A second control device of a second substrate processing apparatus determines whether the processing-start expected time for a substrate is equal to or earlier than a processing-start time limit. If the processing-start expected time is equal to or earlier than the processing-start time limit, the second control device allows the second substrate processing apparatus to execute a first schedule and a second schedule that are initial schedules. On the other hand, if the processing-start expected time is later than the processing-start time limit, the second control device changes the initial first schedule and the initial second schedule so that the processing-start expected time becomes equal to or earlier than the processing-start time limit, and the second control device allows the second substrate processing apparatus to execute the first schedule and the second schedule that have been changed.