Patents by Inventor Yuzo Uemura

Yuzo Uemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220122814
    Abstract: A plasma processing apparatus includes a processing chamber; a placing table disposed in the processing chamber to place a substrate thereon; an upper electrode facing the placing table; a member configured to adjust a temperature of the upper electrode; a first sensor provided within the member configured to adjust the temperature of the upper electrode, and configured to measure the temperature of the upper electrode; and a first sheet member, disposed between the upper electrode and the first sensor, having a relative dielectric constant of 2.4 or higher at a frequency of 1 MHz.
    Type: Application
    Filed: October 15, 2021
    Publication date: April 21, 2022
    Inventors: Takahiro Senda, Yuzo Uemura, Yusei Kuwabara, Tomoya Ujiie
  • Patent number: 8187395
    Abstract: Disclosed is an electrical contact having high electrical conductivity for a compact electromagnetic relay including an internally oxidized silver-oxide material which is prepared by subjecting an Ag alloy having a composition consisting essentially of, by weight, 5.1 to 9% Sn, 1.5 to 5% In, and 0.005 to 0.06% Bi, with the balance being Ag and unavoidable impurities, to an internal oxidation treatment and then subjecting to a heat treatment for diffusion, aggregation, and growth of precipitated oxides, wherein the internally oxidized silver-oxide material has a metallographic structure such that coarse grains of composite oxides are dispersed and distributed in an Ag matrix, the coarse grains of composite oxides being formed as a result of coarsening of ultra-fine grains of Sn-based oxides and ultra-fine grains of In-based oxides, which are precipitated by the internal oxidation treatment, by the heat treatment for diffusion, aggregation, and growth of the precipitated oxides.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: May 29, 2012
    Assignee: Mitsubishi Materials C.M.I. Corporation
    Inventors: Yuzo Uemura, Koshiro Ueda, Noriaki Murahashi, Shinji Yamanashi, Michio Taki, Hiroyasu Endo
  • Publication number: 20050028896
    Abstract: Disclosed is an electrical contact having high electrical conductivity for a compact electromagnetic relay including an internally oxidized silver-oxide material which is prepared by subjecting an Ag alloy having a composition consisting essentially of, by weight, 5.1 to 9% Sn, 1.5 to 5% In, and 0.005 to 0.06% Bi, with the balance being Ag and unavoidable impurities, to an internal oxidation treatment and then subjecting to a heat treatment for diffusion, aggregation, and growth of precipitated oxides, wherein the internally oxidized silver-oxide material has a metallographic structure such that coarse grains of composite oxides are dispersed and distributed in an Ag matrix, the coarse grains of composite oxides being formed as a result of coarsening of ultra-fine grains of Sn-based oxides and ultra-fine grains of In-based oxides, which are precipitated by the internal oxidation treatment, by the heat treatment for diffusion, aggregation, and growth of the precipitated oxides.
    Type: Application
    Filed: August 6, 2004
    Publication date: February 10, 2005
    Applicant: Mitsubishi Materials C.M.I. Corporation
    Inventors: Yuzo Uemura, Koshiro Ueda, Noriaki Murahashi, Shinji Yamanashi, Michio Taki, Hiroyasu Endo
  • Patent number: 5451272
    Abstract: A silver-oxide material for electric contacts of high-current switches, having excellent deposition resistance and consumption resistance. The material is formed by subjecting to an internal oxidation treatment an Ag alloy consisting essentially, by weight %, of:Sn: 5.1-8.5%;In: 1.7-3.2%;Te: 0.1-0.6%; andAg and inevitable impurities: the balance. If required, at least one of the following elements may be added:Ni: 0.05-0.2%; andCd: 0.3-0.8%.
    Type: Grant
    Filed: April 8, 1994
    Date of Patent: September 19, 1995
    Assignee: Mitsubishi Materials Corporation
    Inventors: Yuzo Uemura, Shigeo Shibuya, Manabu Aoki