Patents by Inventor Yuzuru Fujie

Yuzuru Fujie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallic mold structure, transfer molding apparatus, transfer molding method, and optical member forming apparatus
    Patent number: 9643369
    Abstract: A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: May 9, 2017
    Assignee: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Masayuki Kojima, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki
  • Die structure, transfer molding apparatus, transfer molding method, optical member, area light source device, liquid crystal display device, and mobile device
    Patent number: 9162405
    Abstract: A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: October 20, 2015
    Assignee: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kazutaka Kaneko, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki, Masayuki Kojima
  • METALLIC MOLD STRUCTURE, TRANSFER MOLDING APPARATUS, TRANSFER MOLDING METHOD, AND OPTICAL MEMBER FORMING APPARATUS
    Publication number: 20150021797
    Abstract: A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.
    Type: Application
    Filed: June 20, 2014
    Publication date: January 22, 2015
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Masayuki Kojima, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki
  • DIE STRUCTURE, TRANSFER MOLDING APPARATUS, TRANSFER MOLDING METHOD, OPTICAL MEMBER, AREA LIGHT SOURCE DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, AND MOBILE DEVICE
    Publication number: 20140125918
    Abstract: A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.
    Type: Application
    Filed: February 8, 2013
    Publication date: May 8, 2014
    Applicant: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kazutaka Kaneko, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki, Masayuki Kojima