Abstract: A problem that the present invention is to solve is to provide a parts mounting related work device which can prevent the occurrence of an unexpected operation failure and an erroneous stopping of the whole system which are attributed to an error in combination of working head and working equipment. A storage part (24c) stores combinations of types of working heads (H) and types of working equipment (E) which correspond to contents of work that is performed on a board (PB), and a determination part (24d) determines whether or not the combination of the type of the working head (H) which is currently detected by a head type detector and the type of the working equipment which is currently detected by an equipment type detector coincides with any of combinations stored in the storage part (24c).

Abstract: In an electronic component mounting apparatus that is used in an electronic component mounting line for producing a mounted substrate by mounting electronic components on a substrate and that subjects the substrate to predetermined operation, a working unit attachment section 30 is provided within a range of movement of a working head, such as a loading head and a paste coating head, wherein a nozzle stocker 9 and a paste trial coating unit 10 can be removably attached as a working unit for performing specific additional operation appropriate for working function of the working head. The nozzle stoker 9 and the paste trial coating unit 10 are attached to the working unit attachment section 30 according to the type of working head.

Abstract: There is provided a paste application device which can solve problems of an increased exclusively occupied space attributed to an arrangement of a syringe and of deterioration of a tube. In a paste application unit 15 (a paste application device) for applying a paste 7 stored in a syringe 16 to an application target material, a configuration is adopted in which a pump mechanism 18 for sending the paste 7 under pressure is formed by causing a discharge thread portion 32b provided at a lower portion of a rotary member 32 to rotate about an axis AX within a discharge space 31b provided in a casing portion 31, in which a discharge port 17a, which communicates with the discharge space 31b, is provided at an end portion of the casing portion 31, and in which the syringe 16 is disposed coaxially with the rotary member 32 for detachable connection thereto.

Abstract: A problem that the present invention is to solve is to provide a parts mounting related work device which can prevent the occurrence of an unexpected operation failure and an erroneous stopping of the whole system which are attributed to an error in combination of working head and working equipment. A storage part (24c) stores combinations of types of working heads (H) and types of working equipment (E) which correspond to contents of work that is performed on a board (PB), and a determination part (24d) determines whether or not the combination of the type of the working head (H) which is currently detected by a head type detector and the type of the working equipment which is currently detected by an equipment type detector coincides with any of combinations stored in the storage part (24c).

Abstract: Movable claws 13 are formed in clampers 10 holding a substrate 3 so that the movable claws can be selectively moved to a position where they have projected above the substrate 3, and to a position where they have retreated from above the substrate 3. Thereby, the safety of operation is ensured by causing the movable claws 13 to retreat during maintenance. Moreover, printing with high precision can be performed in a state where the surface of the substrate 3 and the rear face of the mask 2 are brought into surface contact with each other without any clearance by causing the movable claws 13 to retreat.

Abstract: It is an object to provide an electronic component mounting apparatus suitable for diverting a single unit to a unit for different operation and a viscous material trial coater that is used in the electronic component mounting apparatus and that enables replacement of a working unit with a working unit of a different type with superior operability. In an electronic component mounting apparatus that is used in an electronic component mounting line for producing a mounted substrate by mounting electronic components on a substrate and that subjects the substrate to predetermined operation, a working unit attachment section 30 is provided within a range of movement of a working head, such as a loading head and a paste coating head, wherein a nozzle stocker 9 and a paste trial coating unit 10 can be removably attached as a working unit for performing specific additional operation appropriate for working function of the working head.

Abstract: In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.

Abstract: In electronic component mounting operation for mounting an electronic component having bumps provided on its lower surface to a substrate by soldering, solder paste is printed on electrodes, and positions of the solder paste are detected in print inspection. An inspection result is output as solder paste position data. In a resin coating process where corners are previously coated with reinforcing resin, control parameters of a coating device that applies the reinforcing resin are updated in accordance with solder paste position data, thereby correcting positions where the coating device applies the reinforcing resin. Mixed application of the reinforcing resin on the already-printed solder paste can thereby be prevented.

Abstract: There is provided a paste application device which can solve problems of an increased exclusively occupied space attributed to an arrangement of a syringe and of deterioration of a tube. In a paste application unit 15 (a paste application device) for applying a paste 7 stored in a syringe 16 to an application target material, a configuration is adopted in which a pump mechanism 18 for sending the paste 7 under pressure is formed by causing a discharge thread portion 32b provided at a lower portion of a rotary member 32 to rotate about an axis AX within a discharge space 31b provided in a casing portion 31, in which a discharge port 17a, which communicates with the discharge space 31b, is provided at an end portion of the casing portion 31, and in which the syringe 16 is disposed coaxially with the rotary member 32 for detachable connection thereto.

Abstract: Movable claws 13 are formed in dampers 10 holding a substrate 3 so that the movable claws can be selectively moved to a position where they have projected above the substrate 3, and to a position where they have retreated from above the substrate 3. Thereby, the safety of operation is ensured by causing the movable claws 13 to retreat during maintenance. Moreover, printing with high precision can be performed in a state where the surface of the substrate 3 and the rear face of the mask 2 are brought into surface contact with each other without any clearance by causing the movable claws 13 to retreat.

Abstract: In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.

Abstract: An applicator has a rubber heater (51) attached to the outer peripheral surface of the application member (4) in the vicinity of a nozzle (3). Thereby, the temperature in the vicinity of the nozzle (3) is controlled by a control unit by detecting the temperature using a thermal resistor (52). A change in the viscosity of the viscous material (2) is prevented by keeping the temperature substantially constant, so that the volume of the viscous material from the nozzle (3) is stabilized.

Abstract: The object of the present invention is to provide an apparatus and a method for applying a viscous fluid whereby a constant application diameter is achieved through a simple operation without a Tact loss while a surface of a member to be applied can be less damaged. An adhesive application member (2111) having a screw portion (2122) inserted therein is rotated by a rotating device (230), so that a nozzle stopper (2114) of the adhesive application member is prevented from interfering with a wiring pattern on a face of a circuit board. Moreover, the screw portion is rotated synchronously as well when the adhesive application member is rotated, thereby preventing the adhesive from being discharged out from the nozzle in consequence to the rotation of the adhesive application member. An application diameter can hence be uniformed.

Abstract: An applicator has a rubber heater (51) attached to the outer peripheral surface of the application member (4) in the vicinity of a nozzle (3). Thereby, the temperature in the vicinity of the nozzle (3) is controlled by a control unit by detecting the temperature using a thermal resistor (52). A change in the viscosity of the viscous material (2) is prevented by keeping the temperature substantially constant, so that the volume of the viscous material from the nozzle (3) is stabilized.

Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.

Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.

Abstract: An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each tables and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

Abstract: A method and apparatus for applying an electronic component adhesive with a minimum length of time for setting a proper application condition. Variation of application shapes of each type of the adhesive is monitored under various different application conditions and its resultant data is saved. When a desired application shape is inputted, the application nozzles are automatically controlled to apply desired doses of the adhesive under an optimum application condition which is defined by retrieving the data previously stored. Also, various different application shapes for bonding respective electronic components may be determined and saved in advance, so that a proper application condition can be automatically determined by retrieving the data on the application shapes when a desired electronic component is selected.

Abstract: An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each table, and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.