Patents by Inventor Yuzuru Miura

Yuzuru Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Deposition method and deposition apparatus
    Patent number: 11289305
    Abstract: A deposition method of arranging a discharge portion of a striker near a target to induce arc discharge and forming a film on a substrate using a plasma generated by the arc discharge is disclosed. The method includes a changing step of changing a position for inducing the arc discharge by the striker in a region set in the target, a deposition step of forming the film on the substrate using the plasma generated by inducing the arc discharge at the position, and a reduction step of reducing the region in accordance with use of the target.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: March 29, 2022
    Assignee: CANON ANELVA CORPORATION
    Inventors: Hiroshi Yakushiji, Yuzuru Miura, Masahiro Shibamoto
  • DEPOSITION METHOD AND DEPOSITION APPARATUS
    Publication number: 20200328062
    Abstract: A deposition method of arranging a discharge portion of a striker near a target to induce arc discharge and forming a film on a substrate using a plasma generated by the arc discharge is disclosed. The method includes a changing step of changing a position for inducing the arc discharge by the striker in a region set in the target, a deposition step of forming the film on the substrate using the plasma generated by inducing the arc discharge at the position, and a reduction step of reducing the region in accordance with use of the target.
    Type: Application
    Filed: June 24, 2020
    Publication date: October 15, 2020
    Applicant: Canon Anelva Corporation
    Inventors: Hiroshi Yakushiji, Yuzuru Miura, Masahiro Shibamoto
  • Vacuum arc deposition apparatus and deposition method
    Patent number: 10731245
    Abstract: A vacuum arc deposition apparatus for forming a ta-C film on a substrate using arc discharge includes a holding unit that holds a target unit, an anode unit into which electrons emitted from the target unit flow, and a power supply that supplies, between the target unit and the anode unit, a current for generating a plasma by arc discharge. The current supplied by the power supply at the time of the arc discharge is generated by superimposing, on a DC current, a pulse current of a pulse frequency not higher than 140 Hz.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: August 4, 2020
    Assignee: Canon Anelva Corporation
    Inventors: Hiroshi Yakushiji, Yuto Watanabe, Masahiro Shibamoto, Yuzuru Miura
  • VACUUM ARC DEPOSITION APPARATUS AND DEPOSITION METHOD
    Publication number: 20180066353
    Abstract: A vacuum arc deposition apparatus for forming a ta-C film on a substrate using arc discharge includes a holding unit that holds a target unit, an anode unit into which electrons emitted from the target unit flow, and a power supply that supplies, between the target unit and the anode unit, a current for generating a plasma by arc discharge. The current supplied by the power supply at the time of the arc discharge is generated by superimposing, on a DC current, a pulse current of a pulse frequency not higher than 140 Hz.
    Type: Application
    Filed: November 8, 2017
    Publication date: March 8, 2018
    Applicant: CANON ANELVA CORPORATION
    Inventors: Hiroshi Yakushiji, Yuto Watanabe, Masahiro Shibamoto, Yuzuru Miura