Abstract: An integrated process for laminating a continuous layer of photosensitive composition to the surface of each member of a series of substrate elements and automatically trimming the layer from the leading and trailing edges of the laminated substrate elements.

Abstract: A photosensitive composition having reduced cold flow comprising (a) addition polymerizable ethylenically unsaturated monomer, (b) an initiating system activatable by actinic radiation, and (c) an organic polymeric binder containing at least two percent by weight, basis binder, of an amphoteric interpolymer.

Abstract: A radiation sensitive element comprising a support bearing a layer of photopolymerizable composition which comprises (1) at least one addition polymerizable ethylenically unsaturated compound, (2) an initiator activatable in the ultraviolet to visible region of the spectrum, and (3) at least 20% by weight of a polymeric binder containing at least 5% by weight of acrylonitrile, the composition having present at least 5% by weight halogen based on the total weight of composition covalently bonded to an aromatic moiety of at least one of said components of the composition and/or a conjugated vinyl component. The elements withstand soldering and are flame retardant and are useful as solder masks.

Abstract: A channeled photosensitive element is described. In particular, the element has a substantially solid photosensitive, thermoplastic layer having grooves or channels therein, the layer being applied with pressure to a surface, e.g., having raised areas such as in a printed circuit board without entrapping air bubbles.

Abstract: A channeled photosensitive element and a process and apparatus for laminating the same are described. In particular, a substantially solid, photoresist-forming layer having grooves or channels therein is applied with pressure to a surface having raised areas, such as a printed circuit board without entrapping air bubbles.