Patents by Inventor Yves Dodo

Yves Dodo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming electric vias
    Patent number: 8298942
    Abstract: A method for forming through vias connecting the front surface to the rear surface of a semiconductor substrate, including the steps of: forming openings in the substrate, thermally oxidizing walls of the openings, filling the openings with a sacrificial material, forming electronic components in the substrate, etching the sacrificial material, filling the openings with a metal, and etching the rear surface of the substrate all the way to the bottom of the openings.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: October 30, 2012
    Assignees: STMicroelectronics SA, STMicroelectronics (Crolles 2) SAS
    Inventors: Richard Fournel, Yves Dodo
  • METHOD FOR FORMING ELECTRIC VIAS
    Publication number: 20110237068
    Abstract: A method for forming through vias connecting the front surface to the rear surface of a semiconductor substrate, including the steps of: forming openings in the substrate, thermally oxidizing walls of the openings, filling the openings with a sacrificial material, forming electronic components in the substrate, etching the sacrificial material, filling the openings with a metal, and etching the rear surface of the substrate all the way to the bottom of the openings.
    Type: Application
    Filed: March 24, 2011
    Publication date: September 29, 2011
    Applicants: STMICROELECTRONICS SA, STMICROELECTRONICS (CROLLES 2) SAS
    Inventors: Richard Fournel, Yves Dodo