Abstract: There is disclosed a reversible heat pump system 100 and a method of operating a reversible heat pump system to control the temperature of a process fluid of a chiller system 500. In a cooling mode, a working fluid is circulated for co-current flow with a process fluid at a heat exchanger 104 functioning as an evaporator heat exchanger, whereas in a heating mode, the working fluid is circulated for counter-current flow with the process fluid at the same heat exchanger 104 functioning as a condenser heat exchanger.

Abstract: A substrate structure for an image sensor package includes a bottom base and a frame layer. The bottom base has an upper surface formed with a plurality of first electrodes, and a lower surface formed with a plurality of second electrodes. An insulation layer is coated between the first electrodes and in direct surface contact with the upper surface of the bottom base. A frame layer is arranged on and in direct surface contact with the first electrodes and the insulation layer to form a cavity together with the bottom base. The insulation layer is interposed between the bottom base and the frame layer.

Abstract: A substrate structure for an image sensor package, the substrate structure includes a bottom base and a frame layer. The bottom base has an upper surface formed with a plurality of first electrodes, and a lower surface formed with a plurality of second electrodes, an insulation layer is coated between each of the first electrode, so as to the upper surface of the bottom base is smooth. A frame layer is arranged on the upper surface of the bottom base to form a cavity together with the bottom base.

Abstract: A mechanism for positioning a substrate of an image sensor. The substrate has first to fourth edges. The mechanism includes a standard unit, a link unit, and a push-up needle unit. The standard unit has adjacent first and second standard planes, both of which define a positioning region for receiving the substrate. The first and second edges contact the first and second standard planes, respectively. The link unit includes a first link and a second link pivotally mounted to the first link at a pivotal portion for positioning the third edge of the substrate. The push-up needle unit positions the fourth edge, a flexible element being arranged within the push-up needle unit so that when the push-up needle unit contacts the fourth edge of the substrate, the push-up may be retractable.

Abstract: An apparatus for removing an adhesive film on a chip that has been cut. The adhesive film is adhered to a bottom surface of the chip. The apparatus includes a sucker, a push-up needle device, and a vacuum chamber. The sucker is arranged above the chip with the adhesive film to suck the chip. The push-up needle device is arranged under the bottom surface of the chip and has a slim support surface to support the adhesive film on the bottom surface of the chip. The vacuum chamber is arranged below the bottom surface of the chip to suck the adhesive film downward and separate the adhesive film from the chip. Accordingly, it is possible to prevent the chip 38 from being broken or cracked owing to the uneven force.

Abstract: A mechanism for positioning a substrate of an image sensor. The substrate has first to fourth edges. The mechanism includes a standard unit, a link unit, and a push-up needle unit. The standard unit has adjacent first and second standard planes, both of which define a positioning region for receiving the substrate. The first and second edges contact the first and second standard planes, respectively. The link unit includes a first link and a second link pivotally mounted to the first link at a pivotal portion for positioning the third edge of the substrate. The push-up needle unit positions the fourth edge. When the link unit operates, the push-up needle unit and the pivotal portion of the link unit are moved toward the fourth edge and the third edge of the substrate, respectively, to position the substrate.

Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.

Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.