Abstract: A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers.

Abstract: A document with a cover having a first cover part, a second cover part, at least one internal page located between the two cover parts when the document is closed, a radiofrequency microcontroller, an antenna electrically connected to the radiofrequency microcontroller, and an electromagnetic shield capable of disrupting, at least partially, the wireless communication with the radiofrequency microcontroller when the document is closed and not disrupting the wireless communication when the document is opened. The electromagnetic shield is a wire grid. The wire mesh distance between each two adjacent wires of the wire grid is smaller than a radio-frequency wavelength used for communicating with the radiofrequency microcontroller, and is at least 0.1 millimeters and at most 40 millimeters.

Abstract: A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers.

Abstract: The chip card comprises a card body and an embedded chip module having a plurality of contact fields connected to respective terminals of the chip. The card body further comprises a positioning feature adapted to univocally identify said contact fields according to their location and orientation on the card body. The positioning feature is a hole or a notch formed on the card body in an area including the chip module such as a contact field which has no electrical functionality as contact field C6 according to ISO 7816-2. The invention is particularly adapted to card bodies including a plug-in removable portion of smaller size comprising said chip module and said positioning feature such as smaller size “mini-plug” SIMs for mobile phones.

Abstract: A document with a cover having a first cover part, a second cover part, at least one internal page located between the two cover parts when the document is closed, a radiofrequency microcontroller, an antenna electrically connected to the radiofrequency microcontroller, and an electromagnetic shield capable of disrupting, at least partially, the wireless communication with the radiofrequency microcontroller when the document is closed and not disrupting the wireless communication when the document is opened. The electromagnetic shield is a wire grid. The wire mesh distance between each two adjacent wires of the wire grid is smaller than a radio-frequency wavelength used for communicating with the radiofrequency microcontroller, and is at least 0.1 millimeters and at most 40 millimeters.

Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).

Abstract: A document which includes a cover, one or more internal pages, a radiofrequency microcontroller, an antenna electrically connected to the radiofrequency microcontroller, an electromagnetic shield capable of partially disrupting wireless communication with the radiofrequency microcontroller when the document is closed, and not disrupting the wireless communication when the document is opened is described. The electromagnetic shield included in the document is implemented using metal, conductive plastic, conductive ink or magnetic ink.

Abstract: The invention concerns an electronic data storage medium including a body (30) made from insulated plastic material which has two main parallel sides, a semiconductor component (34) and a number of external electrical contact pads flush with the first main side (30a) of the body. The body (30) includes a recess (32) opening out onto the first main side (30a). The storage medium also includes a number of conducting elements (28), each with a first end (a) flush with the first main side to form an external contact pad, a second end (b) arranged in the said recess and an intermediate part (c) buried in the body; and A number of connecting elements (38) to electrically connect the terminals of the semiconductor component to the second ends of the conducting elements.

Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).

Abstract: The chip card comprises a card body (24) and an embedded chip module (14) having a plurality of contact fields (C1-C8) connected to respective terminals of the chip. The card body further comprises a positioning feature (28) adapted to univocally identify said contact fields according to their location and orientation on the card body. The positioning feature is a hole or a notch formed on the card body in an area including the chip module such as a contact field (C1-C8) which has no electrical functionality as contact field C6 according to ISO 7816-2. The invention is particularly adapted to card bodies including a plug-in removable portion of smaller size comprising said chip module and said positioning feature such as smaller size “mini-plug” SIMs for mobile phones.

Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).

Abstract: A document which includes a cover, one or more internal pages, a radiofrequency microcontroller, an antenna electrically connected to the radiofrequency microcontroller, an electromagnetic shield capable of partially disrupting wireless communication with the radiofrequency microcontroller when the document is closed, and not disrupting the wireless communication when the document is opened is described. The electromagnetic shield included in the document is implemented using metal, conductive plastic, conductive ink or magnetic ink.

Abstract: A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier body, and a microcircuit-connecting step, in which a microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.

Abstract: This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer (32) including a semiconductor material within which integrated circuits are formed and having a face (34) provided with a plurality of electrical connection terminals (36) and a second face, wherein said face has a thickness smaller than 100 ?m, and a complementary layer (40) having a first face (42) attached to the active face of the active layer, a second face (44) and a side surface (48), wherein said complementary layer includes a plurality of recesses (46), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal (36) to said side surface (48).

Abstract: A tape (T) to which a plurality of elements (C) are affixed by means of a glue in a solid state is manufactured in the following manner. In a gluing step, in which elements (C) are glue to a basic tape (T) by means of a glue in a liquid state so as to obtain a glued tape. The gluing step is followed by a winding step and a heating step. In the winding step, the glued tape (T) is wound while the glue is in a state between the liquid state and the solid state, so as to obtain a winded glued tape. In the heating step, in the winded glued tape is heated, so that the glue reaches the solid state.

Abstract: A method of manufacturing a wafer assembly involves a chip wafer onto which a cover wafer is deposited, the chip wafer includes an active face and an inactive face, the active face includes chip elements, the cover wafer being provided with a chip-element-receiving cavity located above a chip element, the method involves the following steps: a cover-wafer-depositing step, in which a cover wafer is deposited on the active face so as to obtain a wafer assembly, the cover wafer being provided with plurality of chip-receiving cavities, a chip-receiving cavity being located above a chip element, the cover wafer being made of an organic material, and a wafer assembly thinning step, in which the inactive face of the chip wafer is thinned.

Abstract: The invention concerns a method of manufacturing a module intended to create a portable object with chip and antenna. The portable object comprises an antenna and a chip placed on an insulating substrate. The antenna comprises a plurality of turns. The method comprises a first step in which an insulating substrate with at least one side is provided. The method is characterised in that it further comprises a second step in which an individual housing opening in the said side is made for each of the said turns and a third step in which said antenna comprising a plurality of turns is made by placing a conducting material in each individual housing.

Abstract: A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier body, and a microcircuit-connecting step, in which a microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.

Abstract: According to some embodiments, a portable object includes a first side and a second side. The first side of the portable object is provided with a first electronic information support and with a second electronic information support. According to other embodiments, a method of manufacturing a portable object is provided. In a first cavity creation step, a first cavity is created in the first side of the portable object. In a second cavity creation step, a second cavity is created in the first side of the portable object.

Abstract: The invention concerns a method of manufacturing a module (24) intended to create a portable object with chip and antenna (36). The portable object comprises an antenna (20, 20a, 20b, 20c) and a chip (18) placed on an insulating substrate (10). The antenna (20, 20a, 20b, 20c) comprises a plurality of turns (14). The method comprises a first step in which an insulating substrate (10) with at least one side (10′) is provided. The method is characterised in that it further comprises a second step in which an individual housing (12, 12a, 12b, 12c) opening in the said side (10′) is made for each of the said turns (14) and a third step in which said antenna (20, 20a, 20b, 20c) comprising a plurality of turns (14) is made by placing a conducting material (20a, 20b, 20c) in each individual housing (12, 12a, 12b, 12c).