Abstract: The invention relates to a network connector assembly for vehicles. The network communicates at data rates of 100 Mbit/s and/or 1 Gbit/s. The connector assembly includes a header having at least two pins forming a pin pair. The pins extend in a mating direction. The connector assembly also includes an electrically conductive shielding member shielding the pin pair on at least two sides. The shielding member has a front face that is oriented substantially normal to the mating direction. The connector assembly further includes a header shroud, wherein the header shroud is provided with a shielding cavity for receiving the shielding member. The front face of the shielding member is at least partly covered by the header shroud.

Abstract: The invention relates to a network connector assembly for vehicles. The network communicates at data rates of 100 Mbit/s and/or 1 Gbit/s. The connector assembly includes a header having at least two pins forming a pin pair. The pins extend in a mating direction. The connector assembly also includes an electrically conductive shielding member shielding the pin pair on at least two sides. The shielding member has a front face that is oriented substantially normal to the mating direction. The connector assembly further includes a header shroud, wherein the header shroud is provided with a shielding cavity for receiving the shielding member. The front face of the shielding member is at least partly covered by the header shroud.

Abstract: Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.

Abstract: An alignment pin for an optical communication system comprises: a first portion (31) extending along a direction in a receiving hole of a printed circuit board, a second portion (32) extending along this direction in a receiving through hole of an optical coupling device, a third portion (33) extending along this direction in a receiving hole of an external optical component. The pin comprises an abutting surface (35) placed in contact with a parallel complementary surface (36) of the optical coupling device.

Abstract: An optical communication system comprising: an optical circuit board comprising an optical interface having a transmission region, an optical coupling device comprising: a first optical interface having a first transmission region optically coupled to a corresponding transmission region of the optical interface of the optical circuit board, a second optical interface having a second transmission region adapted to be optically coupled to a corresponding transmission region of an optical interface of a mating optical device, a fixation part, wherein the optical communication system comprises a support element glued to the fixation part of the optical coupling device and removably mounted on the optical circuit board.

Abstract: An alignment pin for an optical communication system comprises: a first portion (31) extending along a direction in a receiving hole of a printed circuit board, a second portion (32) extending along this direction in a receiving through hole of an optical coupling device, a third portion (33) extending along this direction in a receiving hole of an external optical component. The pin comprises an abutting surface (35) placed in contact with a parallel complementary surface (36) of the optical coupling device.

Abstract: Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.

Abstract: The invention is related to an electrical circuit for an automotive electrical system. This electrical circuit comprises a filtering element for filtering a triggering signal, the filtering element having a first conductor for connecting to a ground, a squib intended to trigger a SRS device upon reception of the triggering signal, the squib having a ground, wherein the first conductor is connected to the ground of the squib.

Abstract: An optical communication system comprising: an optical circuit board comprising an optical interface having a transmission region, an optical coupling device comprising: a first optical interface having a first transmission region optically coupled to a corresponding transmission region of the optical interface of the optical circuit board, a second optical interface having a second transmission region adapted to be optically coupled to a corresponding transmission region of an optical interface of a mating optical device, a fixation part, wherein the optical communication system comprises a support element glued to the fixation part of the optical coupling device and removably mounted on the optical circuit board.

Abstract: The invention concerns an electrical connector including a box, at least one electrically conductive track and a plurality of first electrical contacts, the first contacts being designed to come into contact with complementary second electrical contacts of a complementary connection device. In order to reduce the manufacturing cost of such an electrical connector and increase the electronic data transfer capacity through this electrical connector, the invention provides that the first electrical contacts are connected to electrically conductive tracks by joining, and that the box is formed by at least one molded plastic that is at least partially metal-coated to form the electrically conductive tracks.

Abstract: The object of the invention is an optical coupling device between at least one waveguide embedded in a printed circuit, for conveying an optical beam (F), and an external waveguide, the circuit including, starting from an exterior surface of the circuit, at least one insulating first layer and at least one internal layer incorporating at least one core of embedded waveguide forming said optical path, the device including a coupling element, positioned in a cut, hollowed out in the circuit and cutting the embedded waveguide, the coupling element being furnished with means of refocusing of the optical beam between the embedded waveguide and the external waveguide and at least one lower positioning surface on a reference surface of the cut in relation to the axis of the embedded waveguide.

Abstract: The invention concerns an integrated intermediate ferrule comprising an optical port and optoelectronic circuits functionally interposed between the optical port and an electric port. To avoid having to place a reflecting mirror causing optical losses, the integrated circuit for detection and optoelectronic conversion is arranged perpendicular to a rectilinear path of the light signal in the ferrule. Such an arrangement eliminates the need for a mirror and makes it easy to obtain accurate setting of the alignment of the optical port and the optoelectronic conversion circuits and finally provides efficient cooling of said optoelectronic conversion circuits.

Abstract: An optoelectric device (1) has an emitter and/or receiver (5) on a first element (13) of a printed circuit (2) of this device. Moreover, the device has at least one second printed-circuit element (32) such that the second element is not in alignment with the first element. And consequently, the device provides for the first element and the second element to be applied against separate and secant faces of a heatsink (4) of the device. The function of this heatsink is to evacuate the heat emitted by an optic connection provided on the device. The heatsink also permits supporting and holding the different portions of the printed circuit.

Abstract: An electro-optical connection module (1) comprises a first end (30) designed to receive optical fibers (11), and comprises means (6) to convert a signal conveyed by these optical fibers into an electrical signal. These means are preferably placed on a rigid portion (4) of a printed circuit (2) contained in this module. Furthermore, this printed circuit portion is connected by means of a flexible printed circuit portion (13) to a printed circuit end (17). This printed circuit end has contacts (100) in the form of an electrical plug at one end (34) of this module. This second end is opposite to the first end of the module. Thus, the optical module is used for an electrical connection and comprises every means to convert the optical signal received into an electrical signal.

Abstract: An optoelectric device (1) has an emitter and/or receiver (5) on a first element (13) of a printed circuit (2) of this device. Moreover, the device has at least one second printed-circuit element (32) such that the second element is not in alignment with the first element. And consequently, the device provides for the first element and the second element to be applied against separate and secant faces of a radiator (4) of the device. The function of this radiator is to evacuate the heat emitted by an optic connection provided on the device. The radiator also permits supporting and holding the different portions of the printed circuit.

Abstract: An electro-optical connection module (1) comprises a first end (30) designed to receive optical fibers (11), and comprises means (6) to convert a signal conveyed by these optical fibers into an electrical signal. These means are preferably placed on a rigid portion (4) of a printed circuit (2) contained in this module. Furthermore, this printed circuit portion is connected by means of a flexible printed circuit portion (13) to a printed circuit end (17). This printed circuit end has contacts (100) in the form of an electrical plug at one end (34) of this module. This second end is opposite to the first end of the module. Thus, the optical module is used for an electrical connection and comprises every means to convert the optical signal received into an electrical signal.

Abstract: The present invention concerns a package for an integrated circuit (3) of the type comprising a cavity (2) in which the integrated circuit (3) is mounted, the active surface (10) of the integrated circuit (3) being electrically connected to the package on the level of connection (Nc) of an array of balls (13i) to the package, providing a mechanical and electrical link between the integrated circuit (3) and a printed circuit card to which the package must be assembled. It is characterized in that it comprises an additional layer (14) that is rigid and electrically neutral, mounted on the level of connection (Nc) of the integrated circuit (3) and the balls (13i) and containing the balls (13i). It particularly applies to the connections of BGA and PBGA packages.

Abstract: The invention applies to packages for transmitting signals at very high frequencies. A package (10) for the integrated circuit (11) comprises conductors disposed on at least two levels (N1-N6) and distributed so that two pairs of conductors of two fixed potentials (18d, 18g; 19d, 19g), along with a conductor (18s) for single-pole transmission of a signal, form a three-dimensional structure which is approximately coaxial having a characteristic impedance which is substantially constant and predetermined.

Abstract: A device for mounting a first element onto a second element to sandwich an electrical or electronic component therebetween, wherein the device is operable to cause the first element to exert a contact force on the component when the first element is mounted onto the second element and to couple the device to the first element in a manner which exerts a mounting force on the first element which is independent of whether the first element is mounted onto the second element. The first element may be a heat sink and the second element may be a printed circuit board.

Abstract: An integrated circuit (IC) package (10), having an integrated circuit (11) and a connecting substrate (12) comprising an insulating film (13), one side of which carries conductors (14) and the other side of which carries balls (15) connected to the respective conductors by means of via holes (16) in the film. The balls (15) are fixed directly to said via holes, the base of which is formed by the respective conductors. The balls are preferably made of a remeltable material such as tin lead and the fixation can be made initially by an adhesive substance. The process for connecting two connecting substrates (12, 22) by means of balls (15), one of which substrates comprises a film (13), one side of which is provided with conductors (14) and the other side of which is provided with via holes (16), consists of fixing the balls directly to the conductors in the via holes by remelting the balls. The balls can be soldered or prefixed by an adhesive substance to connecting pads (23) of a board (22).