Patents by Inventor Zach Wang

Zach Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11992874
    Abstract: A method to manufacture a ceramic foam filter includes: sintering a filter body to a temperature greater than a molten metal to be filtered through the body; creating multiple tortuous path channels extending through the filter body individually having a repeated and controlled passage geometry creating a continuously changing diameter and area of a flow path through the multiple tortuous path channels causing localized increases and decreases in molten metal flow rate through the multiple tortuous path channels; and applying a mixture of at least one ceramic powder and at least one binder using additive manufacturing to shape the filter body including the multiple tortuous path channels.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: May 28, 2024
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Qigui Wang, Andrew Thomas Cunningham, Zach Steffes, Jeffrey B. Harris, Brennon L. White, Liang Wang
  • Patent number: 11791319
    Abstract: Edge-connected semiconductor systems are described along with methods of making and using the same. First and second integrated circuit packages are obtained, each including a substrate assembly having top and bottom sides and an edge that extends between the top and the bottom sides. Edge contacts are disposed on the edges of the substrate assemblies. A ganged assembly is formed by establishing conductive paths between the edge contacts of the substrate assemblies. The ganged assembly is coupled to a printed circuit board (“PCB”) by coupling host contacts on one or more of the substrate assemblies to corresponding contacts on the PCB.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: October 17, 2023
    Assignee: NVIDIA Corporation
    Inventors: Joey Cai, Tiger Yan, Jacky Zhu, Oliver Yi, Zach Wang
  • Publication number: 20220246589
    Abstract: Edge-connected semiconductor systems are described along with methods of making and using the same. First and second integrated circuit packages are obtained, each including a substrate assembly having top and bottom sides and an edge that extends between the top and the bottom sides. Edge contacts are disposed on the edges of the substrate assemblies. A ganged assembly is formed by establishing conductive paths between the edge contacts of the substrate assemblies. The ganged assembly is coupled to a printed circuit board (“PCB”) by coupling host contacts on one or more of the substrate assemblies to corresponding contacts on the PCB.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 4, 2022
    Inventors: Joey Cai, Tiger Yan, Jacky Zhu, Oliver Yi, Zach Wang