Abstract: An integrated circuit die substrate has one or more capacitors attached to an edge surface of the substrate. The substrate has a top surface and a bottom surface, at least one of which includes a die mounting area, and at least one of which includes system interconnect terminals. A substrate edge surface is disposed along a peripheral end of the substrate and is oriented substantially orthogonally to the top and bottom surfaces. A pair of conductive edge terminals is disposed on the substrate edge surface. Each of the edge terminals is electrically coupled to a respective substrate conductor disposed on or inside the substrate. A capacitor is attached exteriorly to the substrate at the substrate edge surface such that terminals of the capacitor are electrically coupled to respective ones of the edge terminals. An integrated circuit die is attached at the die mounting area.

Abstract: Edge-connected semiconductor systems are described along with methods of making and using the same. First and second integrated circuit packages are obtained, each including a substrate assembly having top and bottom sides and an edge that extends between the top and the bottom sides. Edge contacts are disposed on the edges of the substrate assemblies. A ganged assembly is formed by establishing conductive paths between the edge contacts of the substrate assemblies. The ganged assembly is coupled to a printed circuit board (“PCB”) by coupling host contacts on one or more of the substrate assemblies to corresponding contacts on the PCB.

Abstract: Edge-connected semiconductor systems are described along with methods of making and using the same. First and second integrated circuit packages are obtained, each including a substrate assembly having top and bottom sides and an edge that extends between the top and the bottom sides. Edge contacts are disposed on the edges of the substrate assemblies. A ganged assembly is formed by establishing conductive paths between the edge contacts of the substrate assemblies. The ganged assembly is coupled to a printed circuit board (“PCB”) by coupling host contacts on one or more of the substrate assemblies to corresponding contacts on the PCB.