Abstract: A device heater module can be installed within a device such as a server, and can prevent the device from powering on while the temperature of the device is being restored to an operating temperature. The device heater module can prevent the device from powering on by operating a switch to disconnect the device from an external power supply. The device heater module can thereafter actively or passively modify the temperature of the device. After the temperature of the device is restored to within the operating temperature, the device heater module can operate the switch to reconnect the device to the external power supply, thereby allowing the device to initiate a boot process.

Abstract: An information handling system includes a chassis having walls defining an interior cavity within the chassis and a bottom wall defining a backplane on which one or more processors are physically connected. At least one first storage device is connected to the chassis and communicatively coupled to the processor from another location within the chassis. A supplemental storage tray is provided having perimeter plates defining a bay within the supplemental storage tray for receiving a supplemental storage device that is communicatively coupled to the processor and provides additional storage capacity to the information handling system. The supplemental storage tray is physically located above the processor and in a different location from the first storage device.

Abstract: An information handling system includes a chassis having walls defining an interior cavity within the chassis and a bottom wall defining a backplane on which one or more processors are physically connected. At least one first storage device is connected to the chassis and communicatively coupled to the processor from another location within the chassis. A supplemental storage tray is provided having perimeter plates defining a bay within the supplemental storage tray for receiving a supplemental storage device that is communicatively coupled to the processor and provides additional storage capacity to the information handling system. The supplemental storage tray is physically located above the processor and in a different location from the first storage device.

Abstract: An information handling system includes a chassis having walls that define an interior cavity within the chassis. A backplane is mounted to a bottom wall of the chassis and a processor is connected to the backplane. A primary storage device is connected to the chassis and is communicatively coupled to the processor. A supplemental storage tray has perimeter plates that define a bay within the supplemental storage tray. The supplemental storage tray is suspended above the processor by at least one wall of the chassis. A supplemental storage device is disposed in the bay and is communicatively coupled to the processor. The supplemental storage device provides additional storage capacity to the information handling system.

Abstract: An information handling system includes a chassis having walls that define an interior cavity within the chassis. A backplane is mounted to a bottom wall of the chassis and a processor is connected to the backplane. A primary storage device is connected to the chassis and is communicatively coupled to the processor. A supplemental storage tray has perimeter plates that define a bay within the supplemental storage tray. The supplemental storage tray is suspended above the processor by at least one wall of the chassis. A supplemental storage device is disposed in the bay and is communicatively coupled to the processor. The supplemental storage device provides additional storage capacity to the information handling system.

Abstract: In accordance with the present disclosure, a system and method a power deliver system is presented. The power delivery system includes at least two power supplies with a bridge connecting an output of each of the at least two power supplies. The bridge may be made of busbars, each of which including an integral attachment point. Each of the attachment points may correspond to a lug which has been specifically keyed to the shape of the attachment point. The lugs may be attached to conductor cables that provide power from the power supplies to components in an information handling system. In some embodiments, each end of a conductor cable may include lugs of the same shape, to ensure that the correct voltage is supplied to the components of the information handling system.

Abstract: A latching system includes a removable chassis having at least one enclosure coupling feature that is operable to engage an enclosure to house the removable chassis in the enclosure. A moveable component is moveably coupled to the removable chassis. A latch is coupled to the removable chassis. The latch is operable to engage the moveable component when the removable chassis is not housed in the enclosure such that the moveable component is restricted from moving relative to the removable chassis. The latch is operable to disengage the moveable component in response to the removable chassis being housed in the enclosure such that the moveable component is not restricted from moving relative to the removable chassis. The latching system allows the removable chassis to be carried around outside the enclosure without movement of the moveable component, while also allowing the moveable component to move when the removable component is housed in the enclosure.

Abstract: A modular component chassis coupling system includes a chassis having a first component coupling feature and a second component coupling feature located on opposite sides of a housing. A modular component includes a first chassis coupling feature and a second chassis coupling feature. A first handle is coupled to the first chassis coupling feature that is operable to engage the first component coupling feature to move the first handle into a coupling position and, once in the coupling position, the first handle is moved into a securing position to secure the modular component in the housing. A second handle is coupled to the second chassis coupling feature and is operable to engage the second component coupling feature to move the second handle into a coupling position and, once in the coupling position, the second handle is moved into a securing position to secure the modular component in the housing.

Abstract: A latching system includes a removable chassis having at least one enclosure coupling feature that is operable to engage an enclosure to house the removable chassis in the enclosure. A moveable component is moveably coupled to the removable chassis. A latch is coupled to the removable chassis. The latch is operable to engage the moveable component when the removable chassis is not housed in the enclosure such that the moveable component is restricted from moving relative to the removable chassis. The latch is operable to disengage the moveable component in response to the removable chassis being housed in the enclosure such that the moveable component is not restricted from moving relative to the removable chassis. The latching system allows the removable chassis to be carried around outside the enclosure without movement of the moveable component, while also allowing the moveable component to move when the removable component is housed in the enclosure.

Abstract: A modular component chassis coupling system includes a chassis having a first component coupling feature and a second component coupling feature located on opposite sides of a housing. A modular component includes a first chassis coupling feature and a second chassis coupling feature. A first handle is coupled to the first chassis coupling feature that is operable to engage the first component coupling feature to move the first handle into a coupling position and, once in the coupling position, the first handle is moved into a securing position to secure the modular component in the housing. A second handle is coupled to the second chassis coupling feature and is operable to engage the second component coupling feature to move the second handle into a coupling position and, once in the coupling position, the second handle is moved into a securing position to secure the modular component in the housing.

Abstract: In accordance with the present disclosure, a system and method a power deliver system is presented. The power delivery system includes at least two power supplies with a bridge connecting an output of each of the at least two power supplies. The bridge may be made of busbars, each of which including an integral attachment point. Each of the attachment points may correspond to a lug which has been specifically keyed to the shape of the attachment point. The lugs may be attached to conductor cables that provide power from the power supplies to components in an information handling system. In some embodiments, each end of a conductor cable may include lugs of the same shape, to ensure that the correct voltage is supplied to the components of the information handling system.

Abstract: For retaining a heatsink in contact with a processor on a board, a plurality of spaced apart mounting studs are mounted on the board. Each mounting stud includes a pivotally mounted resilient arm and a catch. A pair of the studs are positioned such that the resilient arm of one of the studs pivots to extend to engage the resilient arm catch of an adjacent one of the studs.

Abstract: A component electrical coupling apparatus includes a board comprising a first surface and a second surface located opposite the first surface. A first surface mount technology connector is coupled to the first surface of the board. A second surface mount technology connector is coupled to the second surface of the board and located immediately opposite the first surface mount technology connector, the second surface mount technology connector operable to couple to a different type of connector than the first surface mount technology connector. The component electrical coupling apparatus may be coupled to a component and to an information handling system to allow the component having a connector to be coupled to an information handling system having a different type of connector than the component.

Abstract: A chassis having a pivotable bracket is disclosed. The bracket pivots between an up position to permit an internal cable to be coupled to the bracket and pivots to a down position to form a hood for the passage of heated air into the interior of the computer system. When a component is inserted in the computer system, the component contacts the bracket and forces the bracket to move from the up position to the down position.

Abstract: A component electrical coupling apparatus includes a board comprising a first surface and a second surface located opposite the first surface. A first surface mount technology connector is coupled to the first surface of the board. A second surface mount technology connector is coupled to the second surface of the board and located immediately opposite the first surface mount technology connector, the second surface mount technology connector operable to couple to a different type of connector than the first surface mount technology connector. The component electrical coupling apparatus may be coupled to a component and to an information handling system to allow the component having a connector to be coupled to an information handling system having a different type of connector than the component.

Abstract: An adjustable heat sink shroud includes an insert that may be included within the interior of the heat sink shroud depending on the size of the heat sink enclosed within the shroud. The presence of the insert directs the flow of air through the heat sink.

Abstract: A chassis having a pivotable bracket is disclosed. The bracket pivots between an up position to permit an internal cable to be coupled to the bracket and pivots to a down position to form a hood for the passage of heated air into the interior of the computer system. When a component is inserted in the computer system, the component contacts the bracket and forces the bracket to move from the up position to the down position.

Abstract: An adjustable heat sink shroud includes an insert that may be included within the interior of the heat sink shroud depending on the size of the heat sink enclosed within the shroud. The presence of the insert directs the flow of air through the heat sink.

Abstract: A removable fan bay for a computer system or information handling system is provided that permits the hot swapping of individual fans of the fan bay. The removal of the fan bay enclosures results in the removal of all of the fans of the fan bay. The fan bay is held in place by a securing mechanism that includes a latch and a receiving bracket. The latch includes a retractable handle. When the handled is placed in the raised position, a shoulder in the latch disengages from the receiving bracket, permitting the latch to be released from the receiving bracket and permitting the fan bay to be removed from the chassis of the computer system.

Abstract: A removable fan bay for a computer system or information handling system is provided that permits the hot swapping of individual fans of the fan bay. The removal of the fan bay enclosures results in the removal of all of the fans of the fan bay. The fan bay is held in place by a securing mechanism that includes a latch and a receiving bracket. The latch includes a retractable handle. When the handled is placed in the raised position, a shoulder in the latch disengages from the receiving bracket, permitting the latch to be released from the receiving bracket and permitting the fan bay to be removed from the chassis of the computer system.