Patents by Inventor Zachary A. Stegen

Zachary A. Stegen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid state cooler device
    Patent number: 11333413
    Abstract: A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: May 17, 2022
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Robert Miles Young, Aaron Ashley Hathaway, John X. Przybysz, Gregory R. Boyd, Zachary A. Stegen, Edward R. Engbrecht, Aaron A. Pesetski, Marc Eisenzweig Sherwin
  • SOLID STATE COOLER DEVICE
    Publication number: 20210063060
    Abstract: A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 4, 2021
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Robert Miles Young, Aaron Ashley Hathaway, John X. Przybysz, Gregory R. Boyd, Zachary A. Stegen, Edward R. Engbrecht, Aaron A. Pesetski, Marc Eisenzweig Sherwin