Patents by Inventor Zachary Hartke

Zachary Hartke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of providing an electronic device and electronic device thereof
    Patent number: 10410903
    Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate and the bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the bond promoting layer, the first device substrate bonding to the bond promoting layer with a first device substrate-bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: September 10, 2019
    Assignee: ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
    Inventors: Emmett Howard, Nicholas Munizza, Paul Yee, Zachary Hartke
  • Method of providing an electronic device and electronic device thereof
    Patent number: 10381224
    Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a first bond promoting layer over the carrier substrate; providing a second bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: August 13, 2019
    Assignee: ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
    Inventors: Emmett Howard, Nicholas Munizza, Paul Yee, Zachary Hartke
  • METHOD OF PROVIDING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREOF
    Publication number: 20180102272
    Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate and the bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the bond promoting layer, the first device substrate bonding to the bond promoting layer with a first device substrate-bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.
    Type: Application
    Filed: December 4, 2017
    Publication date: April 12, 2018
    Applicant: Arizona Board of Regents, Acting for and on Behalf of Arizona State University
    Inventors: Emmett Howard, Nick Munizza, Paul Yee, Zachary Hartke
  • METHOD OF PROVIDING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREOF
    Publication number: 20180096848
    Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a first bond promoting layer over the carrier substrate; providing a second bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.
    Type: Application
    Filed: December 4, 2017
    Publication date: April 5, 2018
    Applicant: Arizona Board of Regents, Acting for and on Behalf of Arizona State University
    Inventors: Emmett Howard, Nick Munizza, Paul Yee, Zachary Hartke