Abstract: A method for forming an ink jetting device includes providing a silicon chip including a silicon substrate having a first surface and a second surface opposite to the first surface, the first surface having formed thereon a plurality of electrical heater elements and a silicon oxide ink ejection chamber layer configured to define a plurality of ink ejection chambers; providing a silicon nozzle plate having a silicon nozzle layer having a third surface and a fourth surface opposite to the third surface, the fourth surface having formed thereon a silicon oxide layer; aligning the silicon nozzle plate with the silicon chip; fusion bonding the silicon oxide layer of the silicon nozzle plate to the silicon oxide ink ejection chamber layer of the silicon chip; and forming a plurality of nozzle holes through the silicon nozzle plate respectively located over the plurality of electrical heater elements.