Abstract: Methods of manufacturing a sealed electrical device for embedded integrated circuit (IC) chips are described, as well as the resulting devices themselves. The sealed electrical device is created by removing material from a substrate to form a pocket in the substrate. An unencapsulated, or bare, IC chip can be placed within the pocket with connection pads of the IC chip facing outward. A gap between the IC chip and a side of the pocket can be filled with a filler. An uncured polymer can be cast over the substrate, which can be allowed to cure into a flat polymer sheet. Conductive traces can be patterned on the polymer sheet and to the connection pads of the IC chip. The conductive traces can then be coated with polymer to form a ribbon cable. Substrate can then be removed from underneath the ribbon cable, leaving substrate around the pocket to protect the IC chip.

Abstract: The disclosure provides a method for fabricating a cantilever section in a structure, which includes providing a structure comprising a substrate, a compliant layer and a sacrificial layer therebetween; cutting part-way through the substrate to create an at least one linear partial cut; releasing the sacrificial layer from the structure; and breaking the substrate along the at least one linear partial cut to generate a cantilever section in a substrate.

Abstract: An implantable device and method of manufacture include a substantially hermetic polychlorotrifluoroethylene (PCTFE) enclosure with closely-spaced wires extending out of the enclosure. The implantable device includes a PCTFE first portion of an enclosure and a PCTFE second portion of the enclosure. The first and second portions are configured to mate with each other to form the enclosure. A plurality of insulated wires extend between the first and second portions of the enclosure. Each of the insulated wires are parallel to each other and separated by less than 150 micrometers (?m) from a neighboring wire. A thermal weld seam of PCTFE is disposed between the first portion of the enclosure and the second portion of the enclosure and conformally adheres around insulation of each wire such that the enclosure is sealed.

Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.

Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.

Abstract: Disclosed are biocompatible multi-electrode devices capable of being implanted in sensitive tissue, such as the brain, and methods for fabricating such arrays. The disclosed arrays can be implanted in living biological tissue with a single needle insertion. The devices can include linear arrays with contacts along an edge, linear arrays with multiple electrodes per opening in a parylene support layer, multi-thread electrode arrays, tree-like electrode arrays, and combinations thereof. In an embodiment, a compliant electrode apparatus can comprise a biocompatible and bio-implantable compliant dielectric having a top edge defined by a top and a side along a length of the dielectric, insulated electrical traces oriented along the length of the dielectric, and electrode contacts coupled to the traces and situated on the side along the length of the dielectric, wherein an exposed portion of a respective electrode contact protrudes beyond the top edge of the dielectric.